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TMS3637DR

Texas Instruments

TMS3637DR by Texas Instruments

TMS3637DR by Texas Instruments is an 8-terminal transmitter/receiver IC for remote controls. It operates on a supply voltage range of 3-6V with IR transmission media. With a small outline package style, it measures 4.9mm x 3.9mm x 1.75mm and supports temperatures from -25°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,904 parts In-Stock

1+ parts

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6,904

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Digiode

USA . 3,292 parts In-Stock

1+ parts

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3,292

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 700 parts In-Stock

1+ parts

$0.929

100+ parts

-

1k+ parts

$1.842

10k+ parts

-

700

$0.929

-

$1.842

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$1.023

100+ parts

$0.941

1k+ parts

-

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1,569

$1.023

$0.941

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ChromeModa Solutions

Germany . 4,495 parts In-Stock

1+ parts

$1.044

100+ parts

$0.856

1k+ parts

-

10k+ parts

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4,495

$1.044

$0.856

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

$0.940

10k+ parts

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1,404

$1.044

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$0.940

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One Stop Electronics

USA . 1,002 parts In-Stock

1+ parts

$4.800

100+ parts

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1,002

$4.800

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AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$18.183

100+ parts

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759

$18.183

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Kepictronics

USA . 2,249 parts In-Stock

1+ parts

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2,249

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Corphita

USA . 99 parts In-Stock

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99

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Overview

Experience seamless and reliable remote control applications with the TMS3637DR by Texas Instruments. Crafted with precision and expertise, Texas Instruments has established itself as a trusted manufacturer in the industry. This transmitter/receiver IC offers exceptional value and benefits, guaranteeing top-notch performance and efficiency. Ideal for a variety of applications requiring infrared transmission media, this high-quality product boasts a compact package style and wide operating temperature range. Upgrade your remote control systems with the TMS3637DR and enjoy unparalleled convenience and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, suitable for portable applications.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Transmission Media: INFRARED

Utilizing infrared transmission media ensures reliable and secure communication between the transmitter and receiver, ideal for remote control applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, making it easy to integrate into tight spaces or small devices.

General IC Type: TRANSMITTER/RECEIVER IC

Being a transmitter/receiver IC, this product can perform both sending and receiving functions, simplifying the remote control system design.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and flexibility in the wiring configuration, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for applications with limited board real estate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand challenging environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C allows for operation in cold environments without compromising functionality.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved signal integrity, enhancing the overall reliability of the product.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile, making this product suitable for applications where space is limited.

Width: 3.9 mm

The narrow width of 3.9 mm enables easy integration into compact devices or circuit layouts, offering design flexibility.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V makes this product energy-efficient and suitable for battery-powered applications.

Length: 4.9 mm

The short length of 4.9 mm contributes to a compact form factor, ideal for applications where space is a premium.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and compatibility with a wide range of devices, making this product versatile and efficient.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections, simplifying the assembly process.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm allows for easy interfacing with other components or boards, enhancing the overall usability of the product.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product can handle higher voltage inputs, providing flexibility in power supply options.

Technical Specifications

Remote Control ICs TMS3637DR attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

Additional Features:

RF AND DIRECT WIRE CAN ALSO BE USED FOR TRANSMISSION

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

3.9 mm

Trade Compliance

TMS3637DR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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