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BQ500110RGZT

Texas Instruments

BQ500110RGZT by Texas Instruments

BQ500110RGZT by Texas Instruments is a remote control IC with 48 terminals, operating from -40 to 110°C. It features a max supply voltage of 3.6V, peak reflow temp of 260°C, and industrial temperature grade. Ideal for applications requiring transmitter ICs in compact square chip carrier packages with surface mount capability.

Median Price

$10.975

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$8.780

1k+ parts

$7.850

10k+ parts

$7.390

4,000

-

$8.780

$7.850

$7.390

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$11.550

1k+ parts

-

10k+ parts

-

4,000

-

$11.550

-

-

Verical

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

$10.975

1k+ parts

$9.813

10k+ parts

$9.238

1,750

-

$10.975

$9.813

$9.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,482 parts In-Stock

1+ parts

$8.056

100+ parts

-

1k+ parts

-

10k+ parts

-

4,482

$8.056

-

-

-

Vyrian

USA . 1,156 parts In-Stock

1+ parts

$8.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$8.480

-

-

-

DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 492 parts In-Stock

1+ parts

$0.487

100+ parts

-

1k+ parts

-

10k+ parts

$0.468

492

$0.487

-

-

$0.468

Parana Technologies

USA . 659 parts In-Stock

1+ parts

$0.511

100+ parts

-

1k+ parts

$1.630

10k+ parts

-

659

$0.511

-

$1.630

-

Northwest PG Solutions

USA . 109 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

$0.472

109

$0.536

-

-

$0.472

DigiPath Technology Company

USA . 1,202 parts In-Stock

1+ parts

$0.563

100+ parts

$0.518

1k+ parts

-

10k+ parts

-

1,202

$0.563

$0.518

-

-

ChromeModa Solutions

Germany . 5,115 parts In-Stock

1+ parts

$0.574

100+ parts

$0.471

1k+ parts

-

10k+ parts

-

5,115

$0.574

$0.471

-

-

IDEA Electronic Components Group

UK . 1,414 parts In-Stock

1+ parts

$0.574

100+ parts

-

1k+ parts

$0.517

10k+ parts

-

1,414

$0.574

-

$0.517

-

Corphita

USA . 697 parts In-Stock

1+ parts

$7.632

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$7.632

-

-

-

Microchip USA

USA . 217 parts In-Stock

1+ parts

$26.750

100+ parts

$26.370

1k+ parts

$26.170

10k+ parts

$25.980

217

$26.750

$26.370

$26.170

$25.980

A-Z Elektronik GmbH

Germany . 6,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,936

-

-

-

-

Alle Elektronik GmbH

Germany . 4,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,624

-

-

-

-

Perfect Parts

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

-

-

-

-

ChipstoGo Electronic ltd

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Kepictronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Experience seamless remote control capabilities with the BQ500110RGZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a top-quality transmitter IC that offers unparalleled performance and reliability. Ideal for a wide range of applications, this chip carrier features a very thin profile and quad terminals for easy installation. With a wide operating temperature range and low supply voltage requirements, this product provides exceptional value and benefits to customers looking for advanced remote control solutions. Elevate your electronic projects with the BQ500110RGZT and enjoy the convenience and efficiency it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides a good balance between cost-effectiveness and durability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the IC onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape offers a compact design that can fit well within tight spaces, contributing to overall system miniaturization.

General IC Type: TRANSMITTER IC

A transmitter IC is specifically designed for sending signals wirelessly, making this product ideal for remote control applications.

No. of Terminals: 48

With a higher number of terminals, this IC can offer increased functionality and connectivity options, enhancing its versatility in different configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles helps in efficient heat dissipation and space-saving in the system design.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature tolerance of 110°C ensures reliable performance in various environmental conditions, particularly in industrial settings.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature limit of -40°C, this IC can function reliably even in extreme cold conditions, increasing its overall durability.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity, corrosion resistance, and solderability, contributing to the IC's long-term reliability.

Terminal Position: QUAD

The quad terminal position enhances the IC's stability within the circuit board, providing secure connections for improved performance and durability.

Minimum Supply Voltage (Vsup): 3 V

Operating within a minimum supply voltage of 3V allows for energy-efficient performance, making this IC suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the IC during assembly, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand high-temperature reflow processes during manufacturing without compromising its functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets stringent temperature requirements and reliability standards, making it a robust choice for harsh operating environments.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and industry standards, promoting sustainability and ensuring safe handling during manufacturing and disposal.

Maximum Supply Current: 65 mA

With a maximum supply current of 65mA, this IC offers efficient power consumption and can operate within specified electrical limits, enhancing system reliability.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates a moderate moisture sensitivity, allowing for safe storage and handling of the IC in typical manufacturing environments.

Maximum Supply Voltage (Vsup): 3.6 V

Operating within a maximum supply voltage of 3.6V ensures optimal performance without risking voltage overloads, enhancing the IC's reliability in various applications.

Technical Specifications

Remote Control ICs BQ500110RGZT attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Supply Current:

65 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ500110RGZT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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