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TMC3637P

Texas Instruments

TMC3637P by Texas Instruments

TMC3637P by Texas Instruments is a Remote Control Transmitter IC with 8 terminals, operating at 3.3/5V. It features CMOS technology, -25 to 85°C temp range, and rectangular plastic package. Ideal for remote control applications due to its in-line style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,144 parts In-Stock

1+ parts

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6,144

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Digiode

USA . 2,451 parts In-Stock

1+ parts

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2,451

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Freelance Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,697 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

$1.621

10k+ parts

-

1,697

$0.490

-

$1.621

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

$0.539

100+ parts

$0.496

1k+ parts

-

10k+ parts

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636

$0.539

$0.496

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ChromeModa Solutions

Germany . 5,302 parts In-Stock

1+ parts

$0.550

100+ parts

$0.451

1k+ parts

-

10k+ parts

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5,302

$0.550

$0.451

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IDEA Electronic Components Group

UK . 166 parts In-Stock

1+ parts

$0.550

100+ parts

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1k+ parts

$0.495

10k+ parts

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166

$0.550

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$0.495

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One Stop Electronics

USA . 1,317 parts In-Stock

1+ parts

$13.800

100+ parts

-

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1,317

$13.800

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$15.347

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789

$15.347

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Corphita

USA . 3,526 parts In-Stock

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3,526

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Overview

Enhance your remote control experience with the TMC3637P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The TMC3637P is perfect for a wide range of applications in the category of Remote Control ICs. With its advanced technology and user-friendly design, this transmitter IC offers unmatched value, benefits, and advantages to customers. Upgrade your remote control system today with the TMC3637P and enjoy seamless control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection against external factors, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and installation in various electronic devices.

General IC Type: REMOTE CONTROL TRANSMITTER IC

Specifically designed for remote control applications, ensuring optimal performance and compatibility with remote control systems.

Power Supplies (V): 3.3/5

Supports multiple power supply options, making it versatile and compatible with different electronic systems.

No. of Terminals: 8

Sufficient number of terminals for connecting the IC to external components, enabling proper functionality and communication.

Package Style (Meter): IN-LINE

In-line package style allows for compact and space-saving design, ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions or during extended usage.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality or reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection options, accommodating different PCB layouts and designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy and secure soldering onto the PCB, ensuring stable connections and durability.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with commonly used PCB layouts and components, facilitating easy integration into electronic systems.

Technical Specifications

Remote Control ICs TMC3637P attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMC3637P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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