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M3006LAB1

STMicroelectronics

M3006LAB1 by STMicroelectronics

M3006LAB1 by STMicroelectronics is a bipolar transmitter IC designed for infrared remote control applications. It operates b/w 2V and 6.5V, with a max temp of 70 °C and features a compact in-line package with 16 terminals. Ideal for consumer electronics, it ensures reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,938 parts In-Stock

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2,938

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Vyrian

USA . 1,222 parts In-Stock

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1,222

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Anansix

USA . 599 parts In-Stock

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599

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Huijzer Components

Netherlands . 56 parts In-Stock

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56

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ECAB

Sweden . 24 parts In-Stock

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24

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IDEA Electronic Components Group

UK . 1,174 parts In-Stock

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$0.118

100+ parts

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$0.106

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1,174

$0.118

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$0.106

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MKK Technologies

India . 177 parts In-Stock

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$0.221

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177

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DigiPath Technology Company

USA . 177 parts In-Stock

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$0.221

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177

$0.221

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Kepictronics

USA . 9,990 parts In-Stock

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9,990

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A-Z Elektronik GmbH

Germany . 6,579 parts In-Stock

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6,579

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Alle Elektronik GmbH

Germany . 4,386 parts In-Stock

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Corphita

USA . 2,401 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 691 parts In-Stock

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$0.141

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691

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$0.141

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Overview

Elevate your remote control designs with the M3006LAB1 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust transmitter IC delivers superior performance and reliability, ensuring seamless infrared communication for a variety of applications. With its compact design and impressive operational range, it’s perfect for consumer electronics, automotive systems, and smart home devices. Trust in STMicroelectronics’ legacy of quality to enhance your projects and captivate your customers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and provides a lightweight solution, making it ideal for consumer electronics.

Transmission Media: INFRARED

Infrared transmission is reliable for remote control applications, offering efficient and effective communication without interference from other signals.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards and compatibility with various PCB designs.

General IC Type: TRANSMITTER IC

As a transmitter IC, it specifically addresses remote control functionality, ensuring optimal performance for controlling devices.

Power Supplies (V): 2/6.5

Supports a broad range of supply voltages, allowing flexibility in design and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals provides ample connections for integration into complex circuits, enhancing functionality.

Package Style (Meter): IN-LINE

An in-line package style simplifies mounting and assembly processes, which is beneficial for manufacturers.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for various environments while ensuring reliable performance.

Minimum Operating Temperature: -20 °C

The wide temperature range makes this product versatile for use in both cold and warm conditions.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and provides excellent electrical performance, important for long-term reliability.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB layout and design, making it easier to integrate into various applications.

Maximum Seated Height: 5.1 mm

A low seated height helps maintain a compact design, ideal for space-constrained applications.

Width: 7.62 mm

A manageable width facilitates incorporation into diverse designs, accommodating various spatial requirements.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage allows operation in low-power applications, promoting energy efficiency.

Temperature Grade: COMMERCIAL

Built to commercial standards, this IC is suitable for everyday consumer applications, ensuring reliability under standard conditions.

Technology: BIPOLAR

With bipolar technology, this IC can offer high-speed operation and robust performance in signal transmission.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy assembly and high mechanical strength, making it durable in various applications.

Terminal Pitch: 2.54 mm

The 2.54 mm pitch is standard for many applications, ensuring compatibility with a wide range of PCBs and connectors.

Maximum Supply Voltage (Vsup): 6.5 V

The maximum supply voltage of 6.5 V provides sufficient operational headroom for robust performance in remote control applications.

Technical Specifications

Remote Control ICs M3006LAB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6.5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

M3006LAB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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