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SN76742N

Texas Instruments

SN76742N by Texas Instruments

SN76742N by Texas Instruments is a Remote Control Transmitter IC with 16 terminals in an in-line package. It operates b/w -20°C to 70°C, suitable for commercial applications. Utilizes bipolar technology and has a rectangular plastic/epoxy body ideal for remote control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,781 parts In-Stock

1+ parts

-

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4,781

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Digiode

USA . 739 parts In-Stock

1+ parts

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739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 872 parts In-Stock

1+ parts

$0.435

100+ parts

-

1k+ parts

$1.602

10k+ parts

-

872

$0.435

-

$1.602

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DigiPath Technology Company

USA . 614 parts In-Stock

1+ parts

$0.479

100+ parts

-

1k+ parts

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614

$0.479

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ChromeModa Solutions

Germany . 3,724 parts In-Stock

1+ parts

$0.489

100+ parts

$0.401

1k+ parts

-

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3,724

$0.489

$0.401

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IDEA Electronic Components Group

UK . 136 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

$0.440

10k+ parts

-

136

$0.489

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$0.440

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AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$12.771

100+ parts

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217

$12.771

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One Stop Electronics

USA . 1,431 parts In-Stock

1+ parts

$14.800

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1,431

$14.800

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Corphita

USA . 1,406 parts In-Stock

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1,406

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Overview

Upgrade your remote control experience with the SN76742N by Texas Instruments. Known for their high-quality products, Texas Instruments has designed this remote control transmitter IC to provide reliable performance in a variety of applications. Whether you're looking to enhance your home entertainment system or improve the functionality of your electronic devices, the SN76742N offers unmatched value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy materials are lightweight and durable, making the remote control ICs easy to handle and resistant to damage.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into designs and provides a compact form factor for the remote control ICs.

General IC Type: REMOTE CONTROL TRANSMITTER IC

Specifically designed for remote control applications, ensuring optimal performance and functionality in controlling devices wirelessly.

No. of Terminals: 16

Sufficient number of terminals for connectivity and communication between the remote control IC and other electronic components, enabling seamless operation.

Package Style (Meter): IN-LINE

In-line package style allows for easy placement on a circuit board, simplifying the assembly process for electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, enhancing the durability of the remote control ICs.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in colder environments, making the remote control ICs versatile and suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the remote control IC to other components, allowing for efficient signal transmission and reception.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions, making the remote control ICs widely usable in commercial products.

Technology: BIPOLAR

Bipolar technology offers consistent performance and precise control in remote control applications, ensuring accurate transmission of signals.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables secure and reliable connections with the circuit board, preventing loose connections and ensuring stable operation of the remote control ICs.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into existing circuit designs and facilitates efficient soldering during assembly, enhancing the overall reliability of the remote control ICs.

Technical Specifications

Remote Control ICs SN76742N attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76742N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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