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M29W800FT70N3F

STMicroelectronics

M29W800FT70N3F by STMicroelectronics

M29W800FT70N3F from STMicroelectronics is a 16-bit NOR Flash memory with a density of 8Mbit, ideal for automotive applications. It operates asynchronously at voltages b/w 2.7V and 3.6V, with a max access time of 70ns. Its compact SOIC package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,623 parts In-Stock

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3,623

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Vyrian

USA . 2,485 parts In-Stock

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2,485

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Anansix

USA . 2,387 parts In-Stock

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2,387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$3.318

100+ parts

-

1k+ parts

$2.987

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267

$3.318

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$2.987

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MKK Technologies

India . 561 parts In-Stock

1+ parts

$6.240

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561

$6.240

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DigiPath Technology Company

USA . 561 parts In-Stock

1+ parts

$6.240

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561

$6.240

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Corphita

USA . 2,737 parts In-Stock

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2,737

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Parana Technologies

USA . 139 parts In-Stock

1+ parts

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$3.968

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139

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$3.968

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Overview

Unlock unparalleled performance with STMicroelectronics' M29W800FT70N3F Flash Memory, designed for automotive applications that demand reliability and efficiency. This compact, high-density solution ensures fast asynchronous access while operating in extreme temperatures from -40 °C to 125 °C. Trust in STMicroelectronics’ commitment to quality and innovation, as this memory provides remarkable data integrity and longevity, empowering your projects with the flexibility and robustness they deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and improved performance.

Screening Level: AEC-Q100

This specification indicates that the product meets automotive-grade quality standards, making it reliable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape enhances space efficiency on PCBs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access and processing speeds.

Nominal Supply Voltage / Vsup: 3

A nominal supply voltage of 3V is widely compatible with various electronic systems.

Power Supplies (V): 3/3.3

Multiple power supply options (3V and 3.3V) enhance flexibility in design choices.

No. of Terminals: 48

With 48 terminals, the product offers extensive connectivity for complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline are ideal for space-constrained designs.

Alternate Memory Width: 8

An alternate memory width of 8 bits allows compatibility with various data bus architectures.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in demanding environments.

Organization: 512KX16

The memory organization of 512Kx16 offers efficient data storage for applications requiring moderate capacity.

Minimum Operating Temperature: -40 °C

A wide operating temperature range (-40 °C) makes this product suitable for extreme applications.

No. of Sectors/Size: 1,2,1,15

The flexible sector sizes allow for efficient memory management and data organization.

Terminal Finish: MATTE TIN/TIN BISMUTH

The terminal finish provides excellent solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal position aids in better connectivity and signal integrity.

Maximum Seated Height: 1.2 mm

A low maximum seated height contributes to compact design profiles.

Width: 12 mm

A width of 12 mm allows for easy integration into various electronic systems.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7V further broadens its usability in different applications.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures safe soldering without damaging the components.

Peak Reflow Temperature °C: 260

High peak reflow temperatures indicate compatibility with lead-free soldering processes.

Type: NOR TYPE

NOR type memory offers fast read speeds, making it ideal for applications requiring quick data retrieval.

Common Flash Interface: YES

A common flash interface simplifies integration with various systems and boosts compatibility.

Length: 18.4 mm

A length of 18.4 mm fits well in standard PCB layouts, enhancing integration flexibility.

Programming Voltage (V): 3

A programming voltage of 3V is standard, making it easy to use with existing tools.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and durability in harsh conditions.

Technology: CMOS

CMOS technology contributes to low power consumption and high performance.

Parallel or Serial: PARALLEL

Parallel data access enhances performance, allowing for faster data transfers.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering.

Sector Size (Words): 16K,8K,32K,64K

Versatile sector sizes allow for optimized use of memory depending on application needs.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA ensures efficient power usage in low-power applications.

No. of Words: 524288 words

With 524288 words, the memory offers a substantial storage solution for diverse applications.

Toggle Bit: YES

The toggle bit feature enhances error detection capabilities.

Memory Width: 16

A 16-bit memory width improves data throughput for applications that can leverage it.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for compact designs and efficient board layouts.

No. of Words Code: 512K

The 512K words code denotes a good balance of memory capacity for many applications.

Command User Interface: YES

A command user interface simplifies programming and operation.

Ready or Busy: YES

The ready or busy output provides real-time status feedback for efficient memory operations.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows compatibility with various voltage levels.

Boot Block: TOP

Top boot block design facilitates quick application launches, enhancing performance.

Memory Density: 8388608 bit

With 8388608 bits of memory density, this product meets significant data storage needs.

Memory IC Type: FLASH

As a flash memory IC, it offers non-volatile storage that retains data without power.

Maximum Standby Current: 0.0001 Amp

Low standby current minimizes power consumption, making it ideal for battery-powered applications.

Maximum Access Time: 70 ns

Fast access time of 70 ns ensures quick data read and write operations.

Data Polling: YES

Data polling capability enhances operational efficiency by allowing immediate data verification.

Technical Specifications

Flash Memory M29W800FT70N3F attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Alternate Memory Width:

8

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,15

No. of Terminals:

48

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29W800FT70N3F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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