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M29W040B90K6

STMicroelectronics

M29W040B90K6 by STMicroelectronics

M29W040B90K6 from STMicroelectronics is a 4Mb NOR Flash memory with a 3.3V supply, featuring an asynchronous operating mode and a max access time of 90 ns. It supports industrial applications with a temp range of -40 °C to 85 °C and offers 100k write/erase cycles. Ideal for embedded systems, it comes in a compact chip carrier package with quad terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,799 parts In-Stock

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Anansix

USA . 1,412 parts In-Stock

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Digiode

USA . 444 parts In-Stock

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LWI Electronics Inc

India . 75 parts In-Stock

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J2 Sourcing AB

Sweden . 46 parts In-Stock

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Electronics Depot

USA . 11 parts In-Stock

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Speed Components Ltd

Israel . 8 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 745 parts In-Stock

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$5.158

100+ parts

-

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$4.642

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745

$5.158

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$4.642

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Component Stockers USA

USA . 2,732 parts In-Stock

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$8.290

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$7.880

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$7.620

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$8.290

$7.880

$7.620

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MKK Technologies

India . 494 parts In-Stock

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$9.698

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DigiPath Technology Company

USA . 494 parts In-Stock

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$9.698

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494

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AZTECH Wire

Italy . 670 parts In-Stock

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$12.160

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670

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A-Z Elektronik GmbH

Germany . 6,485 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,323 parts In-Stock

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Corphita

USA . 4,133 parts In-Stock

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Parana Technologies

USA . 1,367 parts In-Stock

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$6.167

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

USA . 392 parts In-Stock

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Kepictronics

USA . 282 parts In-Stock

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Overview

Unlock unparalleled performance with the M29W040B90K6 Flash Memory from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Designed for reliability across diverse applications, this high-quality NOR-type memory ensures swift data access and robust endurance, making it ideal for industrial and consumer electronics. Boost your projects with its efficient power consumption and exceptional temperature resilience, providing you with lasting value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it reliable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides optimized space utilization on PCBs, facilitating easier integration into various designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation ensures faster access times, improving overall performance in data-intensive applications.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal voltage of 3.3V is commonly used in low-power applications, enhancing energy efficiency and compatibility.

Power Supplies (V): 3/3.3

Versatile power supply options enable compatibility with a wide range of systems, simplifying integration.

No. of Terminals: 32

The 32 terminals provide ample connectivity for data and control signals, ensuring comprehensive interaction with the host system.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is suited for high-density applications, making it an excellent choice for space-constrained environments.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the product to function reliably in high-heat environments, suitable for industrial use.

Organization: 512KX8

The 512Kx8 organization offers a balanced configuration for both data storage and access, ideal for various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is robust enough for extreme environments, enhancing its versatility.

No. of Sectors/Size: 8

Multiple sectors provide efficient data organization and management, enhancing performance during data access and updates.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and reliable connections, crucial for ensuring long-term performance in electronic circuits.

Terminal Position: QUAD

Quad terminal position facilitates efficient layout design and easy routing on the PCB, enhancing assembly efficiency.

Maximum Seated Height: 3.56 mm

A compact seated height allows the device to fit into low-profile designs, making it suitable for slim devices.

Width: 11.43 mm

The narrow width of the product allows for space-efficient designs, making it adaptable to a variety of applications.

Minimum Supply Voltage (Vsup): 2.7 V

A low minimum supply voltage enhances compatibility with a broad range of power supply configurations, increasing flexibility.

Type: NOR TYPE

NOR type flash is known for fast random access times, making this product a strong choice for applications requiring speed.

Length: 13.97 mm

A well-defined length contributes to effective layout in PCB design, ensuring systematic assembly and functionality.

Programming Voltage (V): 2.7

A low programming voltage (2.7V) ensures lower power consumption during write operations, contributing to the overall efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade performance, this product can handle rigorous operating conditions, assuring long-term reliability.

Technology: CMOS

CMOS technology enhances performance and reduces power consumption, making it suitable for battery-operated devices.

Parallel or Serial: PARALLEL

Parallel interface supports faster data transfer rates, improving performance in high-speed applications.

Terminal Form: J BEND

J bend terminals ease the mounting process and improve alignment during assembly, enhancing manufacturing efficiency.

Sector Size (Words): 64K

The 64K words sector size balances between efficient data management and speed, facilitating optimal performance in various tasks.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA is low enough to ensure energy efficiency, making this product a good choice for portable devices.

No. of Words: 524288 words

With 524288 words capacity, the product supports substantial data storage needs, making it suitable for a variety of applications.

Toggle Bit: YES

Toggle bit capability enhances error detection and correction, fostering data integrity during operations.

Memory Width: 8

An 8-bit memory width is optimal for most applications, providing a good balance between speed and data size.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard in many designs, facilitating compatibility with existing board designs and ease of assembly.

No. of Words Code: 512K

512K word capacity is suitable for various applications, providing sufficient memory for a wide range of data storage needs.

Command User Interface: YES

A command user interface allows for easy integration and control, simplifying programming and operation.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V offers flexibility in powering options, enabling compatibility with multiple designs.

Endurance: 100000 Write/Erase Cycles

With an endurance of 100,000 cycles, this product is designed for longevity, making it suitable for frequent data modification applications.

Memory Density: 4194304 bit

High memory density ensures ample data storage, making this flash memory an effective choice for demanding applications.

Memory IC Type: FLASH

As a flash memory IC, this product allows for fast read/write operations, making it ideal for modern electronic applications.

Maximum Standby Current: 0.0001 Amp

A very low standby current enhances energy efficiency, critical for battery-powered devices to extend operational life.

Maximum Access Time: 90 ns

With a maximum access time of 90 ns, this product provides quick data retrieval, enhancing system responsiveness.

Data Polling: YES

Data polling feature improves system reliability and ensures data integrity, which is crucial for application stability.

Technical Specifications

Flash Memory M29W040B90K6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M29W040B90K6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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