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M29F400BB70N3T

STMicroelectronics

M29F400BB70N3T by STMicroelectronics

M29F400BB70N3T from STMicroelectronics is a 5V NOR Flash memory with a 256Kx16 organization, ideal for automotive applications. It features a max access time of 70 ns and supports up to 100k write/erase cycles. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,877 parts In-Stock

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4,877

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Vyrian

USA . 4,223 parts In-Stock

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4,223

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Anansix

USA . 625 parts In-Stock

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,077 parts In-Stock

1+ parts

$4.667

100+ parts

-

1k+ parts

$4.200

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1,077

$4.667

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$4.200

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Microchip USA

USA . 304 parts In-Stock

1+ parts

$7.961

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304

$7.961

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MKK Technologies

India . 1,251 parts In-Stock

1+ parts

$8.776

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1,251

$8.776

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DigiPath Technology Company

USA . 1,251 parts In-Stock

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$8.776

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1,251

$8.776

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AZTECH Wire

Italy . 237 parts In-Stock

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$9.890

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237

$9.890

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Corphita

USA . 4,931 parts In-Stock

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4,931

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Parana Technologies

USA . 1,043 parts In-Stock

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$5.580

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1,043

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$5.580

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Overview

Unlock unmatched performance with the M29F400BB70N3T Flash Memory from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics offers this robust NOR flash solution designed for diverse applications—from automotive to industrial devices. Enjoy rapid data access, high endurance, and exceptional temperature resilience, ensuring reliability in demanding environments. Elevate your projects with a memory that combines efficiency and durability, delivering true value for your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various applications.

Surface Mount: YES

Allows for compact designs and easier integration into modern devices.

Package Shape: RECTANGULAR

Standard shape facilitates efficient layout on PCBs.

Operating Mode: ASYNCHRONOUS

Supports fast data access and retrieval, enhancing performance.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for easy compatibility with a wide range of systems.

Power Supplies (V): 5

Simplifies power supply requirements and reduces design complexity.

No. of Terminals: 48

Allows for multiple connections and functionalities, supporting complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design enables use in space-constrained environments.

Alternate Memory Width: 8

Offers flexibility in data handling and optimization for specific applications.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, ensuring reliability in automotive applications.

Organization: 256KX16

Optimal organization for memory management, improving data handling efficiency.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, making it ideal for automotive and industrial uses.

No. of Sectors/Size: 1,2,1,7

Flexible sectoring allows efficient memory management tailored to specific needs.

Terminal Finish: TIN LEAD

Enhanced solderability and environmental resistance ensure secure connections.

Terminal Position: DUAL

Facilitates multi-directional mounting, providing design flexibility.

Maximum Seated Height: 1.2 mm

Low profile aids in developing compact electronic devices.

Width: 12 mm

Standard width accommodates existing designs, simplifying integration.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation with slightly lower voltage, improving compatibility.

Type: NOR TYPE

Fast random access speeds make it suitable for code execution in embedded systems.

Length: 18.4 mm

Compact size enhances installation ease in limited spaces.

Programming Voltage (V): 5

Standard programming voltage facilitates easy integration and usage.

Temperature Grade: AUTOMOTIVE

Specifically designed for automotive standards, ensuring reliability in tough environments.

Technology: CMOS

Low power consumption technology contributes to energy efficiency.

Parallel or Serial: PARALLEL

Supports faster data transfer rates, enhancing overall system performance.

Terminal Form: GULL WING

Improves surface mount soldering accuracy and reliability.

Sector Size (Words): 16K,8K,32K,64K

Versatile sector sizes enable better data management and efficiency.

Maximum Supply Current: 20 mA

Low current consumption contributes to overall system efficiency.

No. of Words: 262144 words

Provides significant memory capacity for embedded applications.

Toggle Bit: YES

Increases system status awareness and improves data handling.

Memory Width: 16

Wide memory width allows handling larger data in a single cycle.

Terminal Pitch: 0.5 mm

Fine pitch design suitable for high-density applications.

No. of Words Code: 256K

Generous code storage capacity ideal for complex applications.

Command User Interface: YES

User-friendly interface simplifies programming and application development.

Ready or Busy: YES

Clear status indicators ease debugging and operational management.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a little flexibility in supply voltage, improving application versatility.

Endurance: 100000 Write/Erase Cycles

High endurance makes it suitable for demanding applications requiring frequent data updates.

Boot Block: BOTTOM

Secured boot block ensures code integrity and secure startup processes.

Memory Density: 4194304 bit

High memory density allows for data-rich applications and complex functionalities.

Memory IC Type: FLASH

Flash memory technology offers non-volatile storage ideal for many applications.

Maximum Standby Current: 0.0001 Amp

Minimal standby current enhances energy efficiency, particularly in battery-operated devices.

Maximum Access Time: 70 ns

Fast access time significantly improves read speeds and overall performance.

Data Polling: YES

Allows for efficient monitoring of memory status, improving usability.

Technical Specifications

Flash Memory M29F400BB70N3T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,7

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29F400BB70N3T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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