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M24128-BBN6

STMicroelectronics

M24128-BBN6 by STMicroelectronics

M24128-BBN6 by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode, ideal for industrial applications. It operates at 5V and supports I2C communication, ensuring efficient data transfer. With a max temp of 85 °C and 100k write/erase cycles, it's reliable for long-term use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,891 parts In-Stock

1+ parts

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2,891

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Digiode

USA . 818 parts In-Stock

1+ parts

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1k+ parts

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818

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Anansix

USA . 303 parts In-Stock

1+ parts

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100+ parts

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303

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,831 parts In-Stock

1+ parts

$1.887

100+ parts

-

1k+ parts

$1.698

10k+ parts

-

1,831

$1.887

-

$1.698

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MKK Technologies

India . 1,200 parts In-Stock

1+ parts

$3.548

100+ parts

-

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10k+ parts

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1,200

$3.548

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DigiPath Technology Company

USA . 1,200 parts In-Stock

1+ parts

$3.548

100+ parts

-

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10k+ parts

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1,200

$3.548

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Corphita

USA . 2,586 parts In-Stock

1+ parts

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2,586

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Parana Technologies

USA . 1,420 parts In-Stock

1+ parts

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100+ parts

$2.256

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1,420

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$2.256

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Overview

Unlock seamless data storage with the M24128-BBN6 EEPROM from STMicroelectronics. Renowned for its reliability and exceptional performance, this 16K memory solution is perfect for various applications, from industrial automation to consumer electronics. Experience peace of mind with robust write protection and a wide operating temperature range. Choose STMicroelectronics for quality that empowers innovation—enhancing your designs while ensuring long-lasting durability and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and resistant to environmental factors, ensuring reliability in various applications.

Package Shape: RECTANGULAR

Compact design allows for efficient space utilization on PCBs.

Operating Mode: SYNCHRONOUS

Provides faster data access and communication, enhancing overall performance.

Nominal Supply Voltage / Vsup: 5V

Standard voltage level compatible with many electronic devices, simplifying integration.

Power Supplies (V): 5

Ensures stable operation across a wide range of applications.

No. of Terminals: 8

Standard terminal count facilitating easy connection in various circuit designs.

Package Style (Meter): IN-LINE

Easier mounting on PCBs, providing flexibility in design layouts.

Maximum Operating Temperature: 85 °C

Suitable for use in high-temperature environments, ensuring reliable performance.

Organization: 16KX8

Provides a significant amount of storage for various data applications.

Minimum Operating Temperature: -40 °C

Ideal for industrial applications where extreme temperatures are a factor.

Terminal Finish: TIN LEAD

Ensures excellent solderability, enhancing reliability in connections.

I2C Control Byte: 1010DDDR

Supports I2C communication for straightforward integration with microcontrollers.

Terminal Position: DUAL

Facilitates easy positioning for soldering and connections on PCBs.

Write Protection: HARDWARE

Prevents unintended data modification, ensuring the integrity of stored information.

Maximum Seated Height: 5.33 mm

Low profile design suits devices with height constraints, enhancing versatility.

Maximum Clock Frequency (fCLK): 0.4 MHz

Provides adequate speed for various data transfer applications, optimizing performance.

Width: 7.62 mm

Compact width allows for efficient use of board space.

Minimum Supply Voltage (Vsup): 4.5V

Offers flexibility in power supply options, accommodating different circuit designs.

Length: 9.27 mm

Compact size allows for integration into space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

Designed for harsh operating conditions, enhancing reliability in demanding environments.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient operation.

Parallel or Serial: SERIAL

Facilitates simpler wiring and connectivity compared to parallel interfaces.

Terminal Form: THROUGH-HOLE

Provides strong mechanical support and reliable electrical connections.

Maximum Supply Current: 2 mA

Low power consumption makes this EEPROM suitable for battery-powered applications.

No. of Words: 16384 words

Substantial memory capacity supports a wide range of applications.

Memory Width: 8

Allows for efficient data handling, especially for byte-oriented operations.

Minimum Data Retention Time: 40 years

Long data retention ensures reliability and longevity of stored information.

Terminal Pitch: 2.54 mm

Standard pitch dimension compatible with common circuit board designs.

No. of Words Code: 16K

Supports versatile applications requiring significant data storage.

Maximum Supply Voltage (Vsup): 5.5V

Provides a range of acceptable voltages for flexibility in diverse applications.

Endurance: 100000 Write/Erase Cycles

High endurance rating ensures reliability for applications with frequent write operations.

Serial Bus Type: I2C

Facilitates communication with multiple devices on a single bus, simplifying design.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time enhances responsiveness in data-driven applications.

Memory Density: 131072 bit

High density allows for effective storage of large amounts of data.

Memory IC Type: EEPROM

Non-volatile memory type retains data without power, ideal for critical applications.

Maximum Standby Current: 0.00001 Amp

Extremely low standby current optimizes energy efficiency, crucial for battery-operated devices.

Technical Specifications

EEPROM M24128-BBN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.27 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BBN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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