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M24128-BDW6G

STMicroelectronics

M24128-BDW6G by STMicroelectronics

M24128-BDW6G by STMicroelectronics is a 16Kx8 EEPROM with a 5V supply, ideal for industrial applications. It features synchronous operation and I2C interface, ensuring efficient data transfer. With a max temp of 85 °C and 100k write cycles, it's reliable for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,306 parts In-Stock

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3,306

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Vyrian

USA . 953 parts In-Stock

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953

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Anansix

USA . 85 parts In-Stock

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 700 parts In-Stock

1+ parts

$2.573

100+ parts

-

1k+ parts

$2.316

10k+ parts

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700

$2.573

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$2.316

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MKK Technologies

India . 666 parts In-Stock

1+ parts

$4.839

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666

$4.839

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DigiPath Technology Company

USA . 666 parts In-Stock

1+ parts

$4.839

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666

$4.839

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Parana Technologies

USA . 2,188 parts In-Stock

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$3.077

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2,188

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$3.077

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Corphita

USA . 1,190 parts In-Stock

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1,190

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Overview

Unlock the potential of your designs with the M24128-BDW6G EEPROM from STMicroelectronics, a trusted leader in cutting-edge technology. This compact, reliable solution delivers exceptional performance in industrial applications, ensuring data integrity even in challenging environments. With outstanding endurance and write protection features, you can trust this versatile memory to enhance your projects while minimizing downtime. Elevate your innovation with ST’s quality and expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides robust protection against various environmental factors, increasing reliability.

Surface Mount: YES

Surface mount capability allows for compact design and ease of assembly in automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient space utilization on PCBs, allowing for tight arrangements in design.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speeds, making it suitable for applications requiring high-performance memory.

Nominal Supply Voltage / Vsup: 5 V

Standard 5 V operation ensures compatibility with a wide range of existing electronic systems and modules.

Power Supplies (V): 5

Single voltage operation simplifies power management in designs, reducing the complexity of power supply circuits.

No. of Terminals: 8

A compact 8-terminal configuration minimizes PCB footprint and allows for efficient layout in space-constrained designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile design enable high-density mounting options on printed circuit boards.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where thermal performance is crucial.

Organization: 16KX8

This memory organization offers flexibility in data management and efficient use of memory space for various applications.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures of -40 °C makes the device reliable for applications in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing long-term durability.

I2C Control Byte: 1010DDDR

I2C compatibility allows easy integration into existing systems, facilitating communication with microcontrollers and other devices.

Terminal Position: DUAL

Dual terminal position enhances flexibility in PCB layout, enabling design optimization based on specific application needs.

Write Protection: HARDWARE

Hardware write protection safeguards data integrity, making this EEPROM ideal for critical applications requiring data security.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm allows for low-profile designs, accommodating space-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz provides sufficient speed for most low to mid-range applications.

Width: 3 mm

A compact width of 3 mm makes this component suitable for integration into narrow spaces on PCBs.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation while maintaining compatibility with various power sources.

Length: 4.4 mm

Its short length aids in miniaturization, essential for modern electronic devices where size is crucial.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates suitability for rigorous environments, enhancing reliability in demanding applications.

Technology: CMOS

CMOS technology is known for low power consumption, making it ideal for portable and energy-conscious applications.

Parallel or Serial: SERIAL

The serial interface simplifies communication wiring and reduces pin count, facilitating easier integration into circuits.

Terminal Form: GULL WING

Gull wing terminals promote better solder joint reliability, reducing the chances of mechanical failure during operation.

Maximum Supply Current: 2 mA

Low maximum supply current minimizes power consumption, which is essential for battery-powered applications.

No. of Words: 16384 words

With a capacity of 16384 words, this EEPROM offers ample space for data storage in various applications.

Memory Width: 8

An 8-bit memory width supports efficient data processing and aligns well with most microcontroller architectures.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years ensures long-term reliability of stored information, critical for archival applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact designs without compromising soldering reliability and performance.

No. of Words Code: 16K

The 16K word capacity ensures compatibility with applications requiring moderate levels of data storage.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V safeguards against overvoltage scenarios, enhancing device longevity.

Endurance: 100000 Write/Erase Cycles

High endurance of 100000 write/erase cycles makes this EEPROM suited for applications requiring frequent updates and revisions.

Serial Bus Type: I2C

The I2C serial bus type enables multiple devices to communicate over a single bus, simplifying system design.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms allows for reasonably fast writing operations, suitable for many applications.

Memory Density: 131072 bit

With 131072 bits of memory density, this EEPROM offers significant storage capability for diverse data needs.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile storage, retaining information even when power is lost, which is essential for critical data.

Maximum Standby Current: 0.00001 Amp

Ultra-low standby current minimizes energy consumption in idle states, making it ideal for low-power applications.

Technical Specifications

EEPROM M24128-BDW6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BDW6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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