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M24128-BDW6P

STMicroelectronics

M24128-BDW6P by STMicroelectronics

M24128-BDW6P by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode, ideal for industrial applications. It features a wide temp range (-40 °C to 85 °C), operates at 5V, and supports I2C communication. With 100k write/erase cycles, it's perfect for reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,349 parts In-Stock

1+ parts

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2,349

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Anansix

USA . 2,270 parts In-Stock

1+ parts

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1k+ parts

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2,270

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Vyrian

USA . 332 parts In-Stock

1+ parts

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332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$4.743

100+ parts

-

1k+ parts

$4.268

10k+ parts

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2,282

$4.743

-

$4.268

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MKK Technologies

India . 2,342 parts In-Stock

1+ parts

$8.918

100+ parts

-

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10k+ parts

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2,342

$8.918

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DigiPath Technology Company

USA . 2,342 parts In-Stock

1+ parts

$8.918

100+ parts

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10k+ parts

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2,342

$8.918

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Corphita

USA . 1,284 parts In-Stock

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1,284

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Parana Technologies

USA . 909 parts In-Stock

1+ parts

-

100+ parts

$5.670

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10k+ parts

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909

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$5.670

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Overview

Unlock unparalleled reliability and performance with the M24128-BDW6P EEPROM from STMicroelectronics. Renowned for their innovation, STMicroelectronics ensures this compact and robust memory solution meets the highest industrial standards. With exceptional endurance and write protection features, it’s ideal for diverse applications, from automotive to consumer electronics. Experience superior data retention and efficiency, empowering your designs with confidence and longevity. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material protects the internal components, making the EEPROM suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various layouts and designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data access and transfer rates, enhancing overall performance.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage level (5V) ensures compatibility with a wide range of devices and systems.

Power Supplies (V): 5 V

Utilizing a single voltage supply simplifies power management in electronic systems.

No. of Terminals: 8

Eight terminals provide ample connectivity options for multifunctionality in various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style allows for high-density mounting and optimizes space on boards.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM is suitable for industrial applications where heat is a concern.

Organization: 16KX8

The organization allows for efficient data storage, making it ideal for applications that require moderate memory capacity.

Minimum Operating Temperature: -40 °C

This low operating temperature range makes the EEPROM suitable for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures reliable connections and enhances durability and performance.

I2C Control Byte: 1010DDDR

I2C control enables easy integration into various communication protocols, facilitating versatile applications.

Terminal Position: DUAL

Dual terminal positions allow for flexible placement on PCBs, making design more customizable.

Write Protection: HARDWARE

Hardware write protection enhances data integrity by preventing accidental erasure or corruption.

Maximum Seated Height: 1.2 mm

A low seated height allows for integration into space-constrained designs without compromising performance.

Maximum Clock Frequency (fCLK): 0.4 MHz

The clock frequency supports reasonable data rates, sufficient for many applications requiring moderate speed.

Width: 3 mm

A compact width contributes to a small footprint on the PCB, beneficial for compact device designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage ensures broad compatibility with varied power supply systems.

Length: 4.4 mm

This short length aids in minimizing overall device size and optimizing PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliable operation in demanding environments, ideal for commercial applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed, beneficial for battery-powered devices.

Parallel or Serial: SERIAL

Serial communication reduces the number of required connections, simplifying design and reducing costs.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability, crucial for long-term electronic performance.

Maximum Supply Current: 2 mA

Low supply current contributes to energy efficiency, resulting in longer battery life in portable devices.

No. of Words: 16384 words

The memory capacity meets the needs of many applications, striking a balance between size and functionality.

Memory Width: 8

An 8-bit memory width offers convenient data handling for various applications, such as embedded systems.

Minimum Data Retention Time: 40 years

A long data retention time ensures that stored information remains intact over extended periods.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch allows for compact designs while maintaining ease of soldering and assembly.

No. of Words Code: 16K

The 16K word coding aligns with common EEPROM requirements, making it versatile for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

This maximum voltage rating allows flexibility in power supply choices without exceeding limits.

Endurance: 100000 Write/Erase Cycles

High endurance ensures long-term reliability and performance in applications with frequent rewrite activities.

Serial Bus Type: I2C

The I2C bus type facilitates easy multi-device communication, ideal for complex circuit designs.

Maximum Write Cycle Time (tWC): 10 ms

A relatively fast write cycle time supports efficient data updates, enhancing application responsiveness.

Memory Density: 131072 bit

The memory density supports a significant amount of data storage, suitable for a range of applications.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile data storage, essential for retaining data without a power supply.

Maximum Standby Current: 0.00001 Amp

The ultra-low standby current minimizes power consumption, making it ideal for battery-operated devices.

Technical Specifications

EEPROM M24128-BDW6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BDW6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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