Loading...

M24128-BDW6

STMicroelectronics

M24128-BDW6 by STMicroelectronics

M24128-BDW6 by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode and I2C interface, ideal for industrial applications. It features a wide temp range (-40 °C to 85°C) and robust write protection. With a max clock frequency of 0.4 MHz, it ensures reliable data retention and endurance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,216

-

-

-

-

Vyrian

USA . 2,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,668

-

-

-

-

Anansix

USA . 1,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,722

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 229 parts In-Stock

1+ parts

$5.493

100+ parts

-

1k+ parts

$4.944

10k+ parts

-

229

$5.493

-

$4.944

-

MKK Technologies

India . 1,819 parts In-Stock

1+ parts

$10.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,819

$10.330

-

-

-

DigiPath Technology Company

USA . 1,819 parts In-Stock

1+ parts

$10.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,819

$10.330

-

-

-

Corphita

USA . 3,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,888

-

-

-

-

Parana Technologies

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

$6.568

1k+ parts

-

10k+ parts

-

1,298

-

$6.568

-

-

Overview

Unlock the potential of your designs with the M24128-BDW6 EEPROM from STMicroelectronics, a trusted name in innovation. This compact, high-performance memory solution is perfect for industrial applications where reliability and efficiency are paramount. With features like hardware write protection and a wide temperature range, it ensures data integrity in any environment. Experience exceptional endurance and seamless integration that enhance your projects while streamlining development!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight and durable packaging, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, enabling space-saving applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer efficiency and speed, providing fast access to stored data.

Nominal Supply Voltage / Vsup: 5 V

A standard 5 V supply voltage is compatible with a wide range of electronics, simplifying integration.

Power Supplies (V): 5

Having a single power supply voltage streamlines circuit design and simplifies power management.

No. of Terminals: 8

Eight terminals ensure versatile connectivity options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style is ideal for applications with limited space, allowing for high-density mounting.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM is suitable for industrial-grade applications.

Organization: 16KX8

This organization allows for efficient data storage and retrieval up to 16K words.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature makes this EEPROM ideal for harsh environments and industrial applications.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and reliability during assembly, crucial for long-term applications.

I2C Control Byte: 1010DDDR

The I2C control byte structure simplifies communication in multi-device environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout design and ease of routing.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security, preventing accidental writes.

Maximum Seated Height: 1.2 mm

A low profile height ensures compatibility with slim designs and high-density applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz supports reliable performance in various applications.

Width: 3 mm

A compact width allows for efficient space utilization in tight electronic designs.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage is low enough to accommodate standard 5 V systems.

Length: 4.4 mm

A short length is advantageous for saving real estate on PCB layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this EEPROM can operate reliably in demanding conditions.

Technology: CMOS

CMOS technology provides lower power consumption and higher speed, enhancing overall performance.

Parallel or Serial: SERIAL

Serial communication minimizes pin usage, making it easier to integrate with microcontrollers and other devices.

Terminal Form: GULL WING

Gull wing form allows easy mounting on PCBs with excellent mechanical stability.

Maximum Supply Current: 2 mA

Low maximum supply current contributes to overall energy efficiency in device design.

No. of Words: 16384 words

The large word count allows for substantial data storage, meeting the needs of various applications.

Memory Width: 8

An 8-bit memory width supports efficient data handling and processing.

Minimum Data Retention Time: 40 years

Long data retention ensures reliability, making it suitable for applications requiring data longevity.

Terminal Pitch: 0.65 mm

The fine terminal pitch is commonplace in modern electronics, supporting high-density applications.

No. of Words Code: 16K

A word code size of 16K allows a good balance of storage capacity and simplicity of addressing.

Maximum Supply Voltage (Vsup): 5.5 V

A safe maximum supply voltage makes the EEPROM versatile and compatible with various supply designs.

Endurance: 100000 Write/Erase Cycles

High endurance assures long-term usability, suitable for applications with frequent updating.

Serial Bus Type: I2C

I2C allows for simple multi-device communication on a shared bus, enhancing ease of integration.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time ensures quick operations, improving system responsiveness.

Memory Density: 131072 bit

High memory density allows for storing significant amounts of data while remaining compact.

Memory IC Type: EEPROM

Being an EEPROM type allows for non-volatile data retention, crucial for many electronic applications.

Maximum Standby Current: 0.00001 Amp

Extremely low standby current ensures energy efficiency, ideal for battery-powered designs.

Technical Specifications

EEPROM M24128-BDW6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BDW6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19