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L9820D013TR

STMicroelectronics

L9820D013TR by STMicroelectronics

L9820D013TR from STMicroelectronics is a robust peripheral driver designed for industrial applications, operating b/w 6V and 25V. It features built-in protections against overcurrent, overvoltage, and thermal issues. With an operating temp range of -40 °C to 85°C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 97,614 parts In-Stock

1+ parts

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97,614

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ComSIT Distribution GmbH

Germany . 14,515 parts In-Stock

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14,515

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Vyrian

USA . 7,564 parts In-Stock

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7,564

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Anansix

USA . 2,569 parts In-Stock

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2,569

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Digiode

USA . 1,964 parts In-Stock

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1,964

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$7.557

100+ parts

-

1k+ parts

$6.801

10k+ parts

-

289

$7.557

-

$6.801

-

AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$14.210

100+ parts

-

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-

10k+ parts

-

504

$14.210

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MKK Technologies

India . 2,162 parts In-Stock

1+ parts

$14.210

100+ parts

-

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2,162

$14.210

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DigiPath Technology Company

USA . 2,162 parts In-Stock

1+ parts

$14.210

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-

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2,162

$14.210

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Microchip USA

USA . 240 parts In-Stock

1+ parts

$17.675

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-

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240

$17.675

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S.R.D Solutions

India . 25,003 parts In-Stock

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25,003

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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Vigor

Singapore . 3,265 parts In-Stock

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3,265

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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Parana Technologies

USA . 1,674 parts In-Stock

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$9.035

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1,674

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$9.035

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

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1,500

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Corphita

USA . 659 parts In-Stock

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659

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Overview

Elevate your designs with the L9820D013TR from STMicroelectronics, a leader in quality and innovation. This robust peripheral driver excels in diverse applications, offering built-in protections against overcurrent, overvoltage, and thermal stress. Its compact, surface-mount design ensures seamless integration while providing outstanding reliability across industrial environments. Choose ST for exceptional performance that drives your projects forward with confidence and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and higher circuit density, making it suitable for modern electronic devices.

Maximum Supply Voltage: 25 V

A high maximum supply voltage ensures versatility, enabling compatibility with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on circuit boards, facilitating efficient layout designs.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protection features enhance safety and reliability, preventing damage to the device and prolonging its life.

Power Supplies (V): 14.4

A nominal power supply of 14.4V aligns with typical industrial standards, ensuring compatibility and performance.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for various applications, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient designs, beneficial for compact electronic devices.

Minimum Supply Voltage: 6 V

The minimum supply voltage of 6V supports a broad range of operating conditions, making it adaptable.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C makes this product suitable for high-temperature environments, assuring reliability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device is ideal for extreme conditions, increasing its range of applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier integration and improved layout options on PCBs.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75mm allows for a compact design, making the product suitable for space-constrained applications.

Width: 3.9 mm

With a narrow width of 3.9mm, this component helps save space on circuit boards, allowing for more flexible designs.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum reflow time of 40 seconds helps ensure soldering quality without risking damage to the component.

Peak Reflow Temperature: 245 °C

High reflow temperatures of 245 °C ensure compatibility with lead-free soldering processes, meeting industry standards.

Length: 4.9 mm

A compact length of 4.9mm makes it suitable for applications where space is a premium.

Temperature Grade: INDUSTRIAL

An industrial temperature grade promises reliability in challenging environments, making it ideal for critical applications.

Technology: BCD

BCD technology offers excellent performance characteristics, enhancing the efficiency and functionality of the driver.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, improving overall performance in circuit designs.

Nominal Supply Voltage: 14.4 V

The nominal supply voltage of 14.4V aligns with standard industrial practices, ensuring ease of use in various applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm allows for compact designs while maintaining ease of assembly and soldering.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, providing guidelines for handling and storage, ensuring product integrity.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This IC type is versatile and commonly used, making it ideal for various digital signal applications.

Output Current Flow Direction: SOURCE

The source output current flow direction allows for straightforward interfacing with other components, enhancing circuit design simplicity.

Technical Specifications

Peripheral Drivers L9820D013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

14.4 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

L9820D013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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