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L9824D

STMicroelectronics

L9824D by STMicroelectronics

STMicroelectronics' L9824D is a 20-terminal peripheral driver with built-in protections for transient, over current, and thermal issues. It operates b/w 5-25V, has a turn-on/off time of 10us, and peak current limit of 0.5A. Widely used in latch-based interface IC applications due to its compact rectangular package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,800 parts In-Stock

1+ parts

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3,800

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Anansix

USA . 2,001 parts In-Stock

1+ parts

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1k+ parts

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2,001

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Vyrian

USA . 159 parts In-Stock

1+ parts

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100+ parts

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159

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$11.423

100+ parts

-

1k+ parts

$10.280

10k+ parts

-

1,216

$11.423

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$10.280

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MKK Technologies

India . 2,168 parts In-Stock

1+ parts

$21.480

100+ parts

-

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10k+ parts

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2,168

$21.480

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DigiPath Technology Company

USA . 2,168 parts In-Stock

1+ parts

$21.480

100+ parts

-

1k+ parts

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10k+ parts

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2,168

$21.480

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Corphita

USA . 2,910 parts In-Stock

1+ parts

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2,910

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Parana Technologies

USA . 1,172 parts In-Stock

1+ parts

-

100+ parts

$13.658

1k+ parts

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10k+ parts

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1,172

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$13.658

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Overview

Enhance your electronics projects with the L9824D peripheral driver from STMicroelectronics. With built-in protections against transients, overcurrent, and thermal issues, this small outline package offers peace of mind while delivering reliable performance. Perfect for a wide range of applications, this product boasts a maximum supply voltage of 25V and a nominal output peak current limit of 0.5A. Trust in STMicroelectronics' reputation for quality and innovation to bring value and benefits to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and reliability for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 25 V

Supports a wide range of supply voltages, making it versatile for different applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections provide added security and prevent damage from transient events, overcurrent, and thermal issues.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple devices or components, increasing flexibility in system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact applications.

Minimum Supply Voltage: 5 V

Supports low supply voltages, allowing for energy-efficient operation.

Maximum Seated Height: 2.65 mm

The low seated height makes it suitable for applications with space constraints.

Width: 7.5 mm

Compact width allows for placement in tight spaces on the circuit board.

Length: 12.8 mm

Optimal length for fitting into various electronic devices and systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability for secure connections.

Turn-on Time: 10 us

Fast turn-on time ensures quick response and operation of the peripheral driver.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various PCB designs.

Nominal Output Peak Current Limit: 0.5 A

The output peak current limit of 0.5A ensures safe operation and protects connected devices.

Interface IC Type: LATCH BASED PERIPHERAL DRIVER

The latch-based interface IC type enables stable and reliable communication with peripheral devices.

Turn-off Time: 10 us

Fast turn-off time for efficient operation and control of the driver.

Output Current Flow Direction: SOURCE

Source output current flow direction is ideal for driving various loads in electronic circuits.

Technical Specifications

Peripheral Drivers L9824D attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.5 mm

Trade Compliance

L9824D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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