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L9822ED

STMicroelectronics

L9822ED by STMicroelectronics

STMicroelectronics L9822ED is a 20-terminal peripheral driver with built-in protections for over current and Zener clamp. It operates at supply voltages b/w 4.5V to 5.5V, delivering a max output current of 1A. This rectangular-shaped driver in small outline package style is ideal for applications requiring buffer or inverter based interface ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,096

-

-

-

-

Digiode

USA . 1,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

-

-

-

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Anansix

USA . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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341

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,410 parts In-Stock

1+ parts

$3.789

100+ parts

-

1k+ parts

$3.411

10k+ parts

-

1,410

$3.789

-

$3.411

-

MKK Technologies

India . 243 parts In-Stock

1+ parts

$7.126

100+ parts

-

1k+ parts

-

10k+ parts

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243

$7.126

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-

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DigiPath Technology Company

USA . 243 parts In-Stock

1+ parts

$7.126

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$7.126

-

-

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Corphita

USA . 2,129 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,129

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-

-

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Parana Technologies

USA . 1,751 parts In-Stock

1+ parts

-

100+ parts

$4.531

1k+ parts

-

10k+ parts

-

1,751

-

$4.531

-

-

Overview

Experience superior performance and reliability with the L9822ED peripheral driver from STMicroelectronics. Designed with precision and innovation, this product offers seamless integration and versatility for a wide range of applications. With built-in protections against over current and zener clamp, the L9822ED ensures optimal functionality and safety. Trust in STMicroelectronics' expertise to deliver high-quality solutions that exceed expectations. Elevate your projects with the value, benefits, and advantages that the L9822ED brings to customers seeking top-tier performance in a compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the peripheral driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can safely handle higher voltages, providing flexibility in system design and compatibility with various power sources.

Package Shape: RECTANGULAR

Compact and space-saving design, suitable for integration into tight spaces on circuit boards.

Built-in Protections: OVER CURRENT; ZENER CLAMP

Ensures safety and protection for connected devices by preventing damage from overcurrent conditions and voltage spikes.

Power Supplies (V): 5

Matches common power supply voltages, making it compatible with a wide range of applications and systems.

No. of Terminals: 20

Offers ample connection points for interfacing with other components, allowing for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

Streamlined and space-efficient package style, making it suitable for compact electronic devices and circuit designs.

Minimum Supply Voltage: 4.5 V

Can operate effectively at low voltages, providing energy-efficient performance in various power supply conditions.

Terminal Finish: TIN LEAD

Provides reliable electrical connections and solderability, ensuring secure attachment to circuit boards.

Terminal Position: DUAL

Dual terminal positions offer flexibility in board layout and component placement, allowing for easier integration into circuit designs.

Maximum Seated Height: 2.65 mm

Low-profile design enables a compact form factor, ideal for space-constrained applications and designs.

Width: 7.5 mm

Compact width dimension facilitates easy integration into circuit layouts with limited space availability.

Length: 12.8 mm

Optimal length dimension for a balanced form factor, ensuring compatibility with standard circuit board layouts and enclosures.

Maximum Output Current: 1 A

Capable of delivering sufficient current to drive peripheral devices, ensuring reliable and stable operation.

Technology: BCDMOS

Utilizes advanced BCDMOS technology for efficient and high-performance operation, enhancing overall system reliability and functionality.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and easy installation, ensuring robust electrical connections for reliable performance.

Nominal Supply Voltage: 5 V

Matches standard supply voltage requirements, ensuring compatibility with common power sources and electronics.

Turn-on Time: 10 us

Fast turn-on time enhances responsiveness and efficiency in driving peripheral devices, improving overall system performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy installation and compatibility with standard PCB layouts, facilitating smooth integration into electronic assemblies.

Driver No. of Bits: 8

Suitable for driving multiple bits of data, offering versatility in interfacing with various peripherals and components.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile IC interface type for buffering or inverting signals to drive peripherals, providing flexibility in system configurations and applications.

Turn-off Time: 10 us

Fast turn-off time ensures quick response and control over connected devices, enhancing overall system performance and efficiency.

Technical Specifications

Peripheral Drivers L9822ED attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; ZENER CLAMP

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.5 mm

Trade Compliance

L9822ED Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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