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L9826TR

STMicroelectronics

L9826TR by STMicroelectronics

L9826TR by STMicroelectronics is a SIPO-based peripheral driver with 8 bits. It has a max output current of 1A and built-in protections for transient, over current, and thermal issues. This driver is commonly used in applications requiring sink output current flow direction at a supply voltage range of 4.5V to 5.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,017 parts In-Stock

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8,017

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Digiode

USA . 3,930 parts In-Stock

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3,930

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Anansix

USA . 1,283 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Corohmni

South Africa . 63 parts In-Stock

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$5.728

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63

$5.728

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Aztec Data Supply Inc.

USA . 36,463 parts In-Stock

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$9.240

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36,463

$9.240

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IDEA Electronic Components Group

UK . 362 parts In-Stock

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$10.421

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$9.379

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362

$10.421

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$9.379

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AZTECH Wire

Italy . 453 parts In-Stock

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$13.951

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453

$13.951

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MKK Technologies

India . 1,284 parts In-Stock

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$19.596

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1,284

$19.596

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DigiPath Technology Company

USA . 1,284 parts In-Stock

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$19.596

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1,284

$19.596

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Ampacity Inc.

Singapore . 144 parts In-Stock

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$48.500

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144

$48.500

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RC Electronics

USA . 36,648 parts In-Stock

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36,648

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Microchip USA

USA . 11,575 parts In-Stock

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Lixinc

USA . 6,431 parts In-Stock

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Argo Parts USA

USA . 4,042 parts In-Stock

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Corphita

USA . 3,275 parts In-Stock

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3,275

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Parana Technologies

USA . 2,236 parts In-Stock

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$12.460

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$12.460

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Vigor

Singapore . 1,840 parts In-Stock

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1,840

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A-Z Elektronik GmbH

Germany . 1,572 parts In-Stock

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Perfect Parts

USA . 1,114 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,048 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Continental Prestige Electronics

USA . 332 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality L9826TR from STMicroelectronics. This peripheral driver offers reliable performance and built-in protections for transient, over current, and thermal issues. Perfect for a wide range of applications, this product provides exceptional value by delivering a maximum output current of 1A while operating at a nominal supply voltage of 5V. Trust in STMicroelectronics' reputation for excellence and choose the L9826TR for your next project to experience the benefits of superior design and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to moisture and temperature variations, ensuring a reliable performance over time.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, making it versatile and adaptable to various applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and compatible with standard mounting techniques, making it easy to incorporate into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections against transient voltage spikes, over current situations, and thermal issues enhance the reliability and safety of the product, protecting both the device and the connected components.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V simplifies the design and compatibility with other components in the system.

No. of Terminals: 20

Having a higher number of terminals provides more flexibility in connecting to various devices and peripherals, offering versatility in system integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where size is a critical factor.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage requirement, the peripheral driver can operate efficiently even with lower voltage power sources, providing flexibility in power options.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance.

Terminal Position: DUAL

The dual terminal position allows for more secure and stable connections, reducing the risk of signal loss or disconnection in demanding operating conditions.

Maximum Seated Height: 2.65 mm

The low maximum seated height profile makes this peripheral driver suitable for applications with height restrictions, enabling compact and space-saving designs.

Width: 7.5 mm

The compact width dimension contributes to the overall small form factor of the product, facilitating easy installation and integration in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for proper soldering and bonding of the component during assembly, ensuring a reliable connection to the PCB.

Peak Reflow Temperature °C: 225

With a high peak reflow temperature rating, the peripheral driver can withstand the soldering process without compromising its functionality or durability.

Length: 12.8 mm

The moderate length dimension offers a balanced form factor, making it suitable for a wide range of applications without sacrificing performance or compatibility.

Maximum Output Current: 1 A

The high maximum output current rating allows the peripheral driver to drive larger loads or multiple devices simultaneously, offering greater flexibility in system design and functionality.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability during soldering and operation, ensuring a secure attachment to the PCB for reliable performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and other components in the system, simplifying the design and integration process.

Turn-on Time: 10 us

The fast turn-on time allows the peripheral driver to respond quickly to input signals, reducing latency and improving system responsiveness for enhanced performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch facilitates easy connection to the PCB and other components, ensuring compatibility and simplifying the assembly process.

Driver No. of Bits: 8

With 8 driver bits, this peripheral driver can control multiple outputs or functions independently, offering greater flexibility and control in diverse applications.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level of 3 indicates that the peripheral driver can withstand occasional exposure to moisture during storage or operation without significant impact on performance.

Nominal Output Peak Current Limit: 1 A

The nominal output peak current limit of 1A ensures safe operation and protection against overloading or short circuits, enhancing the reliability and longevity of the device.

Interface IC Type: SIPO BASED PERIPHERAL DRIVER

The SIPO (Serial-In Parallel-Out) based interface allows for efficient data transfer and control of multiple peripherals, enabling seamless communication and synchronization in complex systems.

Turn-off Time: 10 us

The fast turn-off time ensures quick response to control signals, enabling precise timing and coordination of output functions for optimal performance and reliability.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to efficiently control and regulate the current flowing into connected devices, ensuring stable and safe operation for the entire system.

Technical Specifications

Peripheral Drivers L9826TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

8

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

225

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.5 mm

Trade Compliance

L9826TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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