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L6731D

STMicroelectronics

L6731D by STMicroelectronics

L6731D by STMicroelectronics is a compact switching regulator with a max output current of 20 A and operates in voltage-mode control. It supports input voltages from 1.8 V to 14 V, making it ideal for industrial applications. Its small outline design ensures efficient thermal management and space-saving integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,514 parts In-Stock

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8,514

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Digiode

USA . 2,902 parts In-Stock

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2,902

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Anansix

USA . 729 parts In-Stock

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729

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 133 parts In-Stock

1+ parts

$4.825

100+ parts

-

1k+ parts

$4.343

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133

$4.825

-

$4.343

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MKK Technologies

India . 1,844 parts In-Stock

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$9.074

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1,844

$9.074

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DigiPath Technology Company

USA . 1,844 parts In-Stock

1+ parts

$9.074

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-

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1,844

$9.074

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AZTECH Wire

Italy . 767 parts In-Stock

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$14.050

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767

$14.050

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A-Z Elektronik GmbH

Germany . 6,086 parts In-Stock

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6,086

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Alle Elektronik GmbH

Germany . 4,057 parts In-Stock

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4,057

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Microchip USA

USA . 3,935 parts In-Stock

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3,935

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Corphita

USA . 3,167 parts In-Stock

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3,167

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Parana Technologies

USA . 2,161 parts In-Stock

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$5.770

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2,161

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$5.770

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Kepictronics

USA . 86 parts In-Stock

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86

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Overview

Unlock the power of efficiency with the L6731D by STMicroelectronics, a leader in innovative semiconductor solutions. This advanced switching regulator excels in performance and reliability, making it ideal for industrial applications demanding precision and durability. With its compact design and robust operating range, the L6731D ensures seamless integration into your projects, delivering exceptional energy savings and enhancing system longevity. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount design enables compact circuit board layouts and enhances integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, facilitating easier assembly and integration.

No. of Terminals: 16

Having 16 terminals allows for versatile connections and configurations in complex circuits.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style combines a thin profile with efficient heat dissipation, making it ideal for space-constrained applications where thermal performance is critical.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in various industrial environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers simplicity and stability in regulation, making it suitable for many switching regulator applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C provides flexibility for use in extreme temperature applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and longevity, resulting in reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for efficient routing on circuit boards and simplifies soldering processes.

Maximum Seated Height: 1.2 mm

The low seating height further contributes to a compact board design, crucial for portable electronic applications.

Width: 4.4 mm

A width of 4.4 mm aids in minimizing PCB space usage without sacrificing functionality.

Other IC Type: SWITCHING CONTROLLER

As a switching controller, it efficiently converts and regulates voltage, suitable for various power management applications.

Maximum Time At Peak Reflow Temperature: 40 s

A peak reflow time of 40 seconds allows for efficient assembly during surface mount soldering processes.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance ensures compatibility with most common soldering processes.

Length: 5 mm

The compact length aids in reducing overall device size without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and robustness in demanding applications.

Maximum Switching Frequency: 500 kHz

A high switching frequency allows for smaller filter components, improving efficiency and saving PCB space.

Maximum Output Current: 20 A

Capable of handling 20 A output current, this part can support high-power applications effectively.

Technology: BICMOS

The BICMOS technology combines the benefits of bipolar and CMOS, enhancing performance and power efficiency.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, making assembly simpler and more robust.

Control Technique: PULSE WIDTH MODULATION

PWM control improves voltage regulation and efficiency, a key feature for modern power management.

Switcher Config: BUCK

The buck configuration is efficient for stepping down voltages, ideal for battery-powered and low-voltage applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables compact designs while ensuring adequate spacing for soldering.

Moisture Sensitivity Level (MSL): 3

With MSL 3, appropriate handling and reflow practices ensure reliability in moisture-sensitive applications.

Minimum Input Voltage: 1.8 V

A low minimum input voltage allows for compatibility with a wide range of power sources, including battery applications.

Maximum Input Voltage: 14 V

The ability to handle up to 14 V makes it suitable for a variety of applications from low to moderately high voltage systems.

Technical Specifications

Switching Regulators & Controllers L6731D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

L6731D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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