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L6732TR

STMicroelectronics

L6732TR by STMicroelectronics

L6732TR by STMicroelectronics is a versatile switching regulator with a max input voltage of 14V and operates in a temp range of -25 °C to 125°C. It features a compact 16-terminal design and achieves up to 500 kHz switching frequency. Ideal for efficient power management in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,032 parts In-Stock

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7,032

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Anansix

USA . 1,771 parts In-Stock

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1,771

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Digiode

USA . 944 parts In-Stock

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944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 220 parts In-Stock

1+ parts

$4.692

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-

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220

$4.692

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

$5.678

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-

2,080

$6.308

-

$5.678

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MKK Technologies

India . 1,951 parts In-Stock

1+ parts

$11.863

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-

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1,951

$11.863

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DigiPath Technology Company

USA . 1,951 parts In-Stock

1+ parts

$11.863

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-

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1,951

$11.863

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AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$16.340

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-

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42

$16.340

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Component Stockers USA

USA . 439 parts In-Stock

1+ parts

$99.990

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-

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439

$99.990

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A-Z Elektronik GmbH

Germany . 4,982 parts In-Stock

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4,982

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Corphita

USA . 4,975 parts In-Stock

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4,975

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QUARKTWIN TECHNOLOGY LTD

USA . 4,648 parts In-Stock

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4,648

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Alle Elektronik GmbH

Germany . 3,321 parts In-Stock

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3,321

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Vigor

Singapore . 2,125 parts In-Stock

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2,125

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Parana Technologies

USA . 998 parts In-Stock

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$7.543

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998

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$7.543

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Metaverse IC Inc.

Canada . 707 parts In-Stock

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Kepictronics

USA . 607 parts In-Stock

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607

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Overview

Elevate your designs with the L6732TR by STMicroelectronics, a premier solution in switching regulators. Renowned for their quality and innovation, STMicroelectronics delivers exceptional reliability and performance. Ideal for a range of applications, from industrial automation to consumer electronics, this compact regulator ensures efficient power management, safeguarding your projects while optimizing energy use. Experience superior control and stability, enhancing your product's value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient usage of space on PCB and facilitates automation in production.

Package Shape: RECTANGULAR

The rectangular shape provides flexibility in design layout and optimizes space utilization on circuit boards.

No. of Terminals: 16

Having 16 terminals increases the number of connections and functionalities that can be incorporated into your design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This compact package style enhances thermal performance and allows for dense PCB designs, which is advantageous for miniaturization.

Maximum Operating Temperature: 125 °C

Withstand high temperatures, ensuring reliable operation in demanding environments and enhancing overall product longevity.

Control Mode: VOLTAGE-MODE

Voltage mode control provides stable output voltage regulation, which is essential for powering sensitive electronics.

Minimum Operating Temperature: -25 °C

This wide temperature range ensures functionality in low-temperature environments, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing connection reliability.

Terminal Position: DUAL

Dual terminal position facilitates easier layout on circuit boards and improves connection options for enhanced design flexibility.

Maximum Seated Height: 1.2 mm

The low seated height allows for a more compact design and can accommodate tighter spacing in PCB designs.

Width: 4.4 mm

A narrower design helps in creating more space for additional components on the PCB.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it provides better efficiency compared to linear regulators, reducing heat generation and power loss.

Nominal Input Voltage: 12 V

A standard nominal input voltage makes it compatible with a wide range of power supplies and systems.

Maximum Time At Peak Reflow Temperature (s): 40

Extended reflow times ensure better soldering processes during manufacturing, leading to higher reliability in connections.

Peak Reflow Temperature °C: 260

High peak temperatures during reflow soldering ensure robust solder joints that enhance connection integrity.

Length: 5 mm

A compact length supports versatile placement options on PCB, beneficial for space-constrained designs.

Maximum Switching Frequency: 500 kHz

High switching frequency allows for a smaller output filter size and enhances transient response, beneficial for fast load changes.

Technology: BCDMOS

BDCMOS technology ensures efficient performance and low power consumption, which is crucial for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve connection stability on the PCB.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides precise output voltage control and enhances overall efficiency.

Switcher Config: PUSH-PULL

Push-pull configuration improves efficiency and performance in power applications, allowing for better power management.

Terminal Pitch: 0.65 mm

A smaller terminal pitch enables higher density designs, maximizing PCB space and component placement flexibility.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring appropriate handling procedures during assembly.

Minimum Input Voltage: 4.5 V

A low minimum input voltage allows for broader compatibility with various power sources and application scenarios.

Maximum Input Voltage: 14 V

A higher maximum input voltage provides flexibility in application design, capable of handling robust power supply variations.

Technical Specifications

Switching Regulators & Controllers L6732TR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

500 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

L6732TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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