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L6732CTR

STMicroelectronics

L6732CTR by STMicroelectronics

L6732CTR by STMicroelectronics is a compact switching regulator with a max output current of 20 A and operates in voltage-mode control. It supports input voltages from 1.8 V to 14 V, making it ideal for industrial applications. Its small outline package ensures efficient thermal management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,845 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,845

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-

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Vyrian

USA . 1,354 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,354

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Anansix

USA . 587 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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587

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 498 parts In-Stock

1+ parts

$4.389

100+ parts

-

1k+ parts

-

10k+ parts

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498

$4.389

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-

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$5.821

100+ parts

-

1k+ parts

$5.239

10k+ parts

-

1,217

$5.821

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$5.239

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MKK Technologies

India . 342 parts In-Stock

1+ parts

$10.946

100+ parts

-

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342

$10.946

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-

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DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$10.946

100+ parts

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342

$10.946

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-

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Vigor

Singapore . 7,500 parts In-Stock

1+ parts

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7,500

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-

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

$6.960

1k+ parts

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10k+ parts

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1,731

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$6.960

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Corphita

USA . 191 parts In-Stock

1+ parts

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191

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Overview

Unlock the power of efficiency with the L6732CTR from STMicroelectronics, a leader in innovative electronics. This compact switching regulator ensures reliable performance across industrial applications, delivering up to 20 A of output current with precision and stability. Designed for extreme conditions, it operates seamlessly from -40 °C to 85°C. Trust in STMicroelectronics' commitment to quality and elevate your projects with this exceptional, versatile component that enhances performance while reducing energy costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability in various operating environments.

Surface Mount: YES

Surface mount capability allows for compact designs and simplified PCB layout, reducing overall board size.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on the PCB, allowing for denser component placement.

No. of Terminals: 16

With 16 terminals, this product supports complex applications and provides multiple connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This packaging style aids in heat dissipation and minimizes space requirements, ideal for high-performance applications.

Maximum Operating Temperature: 85 °C

A high operating temperature range enhances reliability in demanding environments, being suitable for industrial applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control optimizes performance for various applications, providing stable and reliable output voltage.

Minimum Operating Temperature: -40 °C

The wide temperature range enables functionality in extreme conditions, suitable for industrial and automotive environments.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible PCB designs and improved soldering options.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for slim designs and compact electronic devices.

Width: 4.4 mm

Narrow width enhances design flexibility, making it easier to fit into constrained spaces.

Other IC type: SWITCHING CONTROLLER

As a switching controller, this IC provides efficient power management solutions, improving system performance.

Length: 5 mm

Short length contributes to a compact design, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and durability in harsh operating environments.

Maximum Switching Frequency: 500 kHz

A high switching frequency enables faster response times and improved efficiency in power conversion.

Maximum Output Current: 20 A

With a high output current capability, this product is well-suited for demanding load requirements.

Technology: BICMOS

BICMOS technology combines the best features of bipolar and CMOS processes, ensuring low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and reduce the risk of damage during assembly.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides precise regulation of output voltage, ensuring stable performance across various loads.

Switcher Config: BUCK

The buck converter configuration is highly efficient for stepping down voltage, making it suitable for battery-operated devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch supports modern compact PCB layouts while maintaining ease of manufacturing.

Minimum Input Voltage: 1.8 V

A low minimum input voltage allows for operation with lower supply voltages, increasing versatility.

Maximum Input Voltage: 14 V

The ability to handle a maximum input voltage of 14 V makes this product suitable for a variety of power supply systems.

Technical Specifications

Switching Regulators & Controllers L6732CTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

L6732CTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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