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L6730TR

STMicroelectronics

L6730TR by STMicroelectronics

L6730TR by STMicroelectronics is a versatile buck switching regulator with a max output current of 20 A and operates b/w 1.8 V to 14 V. It features a compact design (4.4 mm x 6.5 mm) and supports PWM control for efficient voltage regulation. Ideal for power management in various electronic applications, it withstands temps from -25 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,017 parts In-Stock

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12,017

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Anansix

USA . 1,745 parts In-Stock

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1,745

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Cyclops Electronics Ltd

UK . 403 parts In-Stock

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403

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Digiode

USA . 371 parts In-Stock

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371

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Distributors (Availability)

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Microchip USA

USA . 312 parts In-Stock

1+ parts

$6.573

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312

$6.573

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AZTECH Wire

Italy . 199 parts In-Stock

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$18.340

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199

$18.340

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

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$19.302

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-

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$17.371

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1,338

$19.302

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$17.371

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MKK Technologies

India . 836 parts In-Stock

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$36.295

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836

$36.295

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DigiPath Technology Company

USA . 836 parts In-Stock

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$36.295

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836

$36.295

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Component Stockers USA

USA . 723 parts In-Stock

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$99.990

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723

$99.990

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Perfect Parts

USA . 13,973 parts In-Stock

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13,973

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Vigor

Singapore . 2,180 parts In-Stock

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Parana Technologies

USA . 2,096 parts In-Stock

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$23.078

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$23.078

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Corphita

USA . 1,637 parts In-Stock

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1,637

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Overview

Unlock exceptional efficiency with the L6730TR from STMicroelectronics, a trusted leader in cutting-edge semiconductor solutions. This compact switching regulator delivers outstanding performance across diverse applications—from consumer electronics to industrial automation. With its robust design and superior thermal management, it ensures reliable operation in challenging environments. Choose the L6730TR for unmatched quality and innovation that elevates your projects and powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protects the internal components from environmental factors.

Surface Mount: YES

Surface mount technology facilitates compact designs, enabling high-density circuit layouts, which is essential for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards, making it easier to integrate into various applications.

No. of Terminals: 20

With 20 terminals, this component provides flexible connections for various functions, enhancing its versatility in complex circuitry.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The compact design and heat sink capability allow for efficient thermal management in high-performance applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature permits reliable operation in demanding environments, making it suitable for automotive and industrial applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers straightforward implementation and stable performance under varying load conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures functionality in cold climates, broadening the range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent corrosion resistance and ensures reliable electrical connectivity.

Terminal Position: DUAL

Dual terminal positions allow for more flexible PCB layouts, making it easier to design intricate circuit paths.

Maximum Seated Height: 1.2 mm

The low seated height aids in creating slim profiles for devices without compromising on performance.

Width: 4.4 mm

Narrow width contributes to compact circuit designs, ideal for space-constrained applications.

Other IC type: SWITCHING CONTROLLER

Being a switching controller means it can efficiently regulate power supply, enhancing energy conservation.

Nominal Input Voltage: 12 V

A nominal input voltage of 12V is compatible with many common power systems, providing ease of integration.

Maximum Time At Peak Reflow Temperature (s): 40

A longer exposure time at peak temperature ensures effective soldering during assembly, resulting in better reliability.

Peak Reflow Temperature: 260 °C

The ability to withstand high peak temperatures ensures compatibility with modern soldering processes.

Length: 6.5 mm

Compact length allows for high-density designs, promoting efficient use of PCB real estate.

Maximum Switching Frequency: 1000 kHz

High switching frequency allows for smaller inductors and capacitors, leading to reduced PCB size and improved performance.

Maximum Output Current: 20 A

Supporting up to 20 A output current makes this regulator suitable for high-power applications, ensuring efficient performance.

Technology: BICMOS

BICMOS technology combines the strengths of bipolar and CMOS transistors, delivering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent strength and reliability in solder joints, enhancing the durability of the assembly.

Control Technique: PULSE WIDTH MODULATION

Pulse Width Modulation control technique offers precise output voltage regulation, ensuring high efficiency and less power loss.

Switcher Config: BUCK

Buck configuration efficiently steps down voltage, making it ideal for battery-powered devices and applications requiring reduced voltage.

Terminal Pitch: 0.65 mm

A smaller terminal pitch supports finer PCB layouts, enabling higher component densities in sophisticated electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a reasonable level of moisture requirements before soldering, making it useful for production environments.

Minimum Input Voltage: 1.8 V

A minimum input voltage of 1.8 V allows for wide compatibility with various battery and supply types, enhancing end-user flexibility.

Maximum Input Voltage: 14 V

The ability to handle up to 14V input ensures compatibility with a broad range of power sources, making it versatile for many applications.

Technical Specifications

Switching Regulators & Controllers L6730TR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

L6730TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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