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L6731B

STMicroelectronics

L6731B by STMicroelectronics

L6731B by STMicroelectronics is a compact switching regulator designed for efficient power management. It operates in voltage mode with a max output current of 20 A and supports input voltages from 1.8 V to 14 V, making it ideal for various applications. Its high switching frequency of 500 kHz ensures optimal performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,405 parts In-Stock

1+ parts

-

100+ parts

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3,405

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-

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Anansix

USA . 2,513 parts In-Stock

1+ parts

-

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1k+ parts

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2,513

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Digiode

USA . 513 parts In-Stock

1+ parts

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513

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$4.439

100+ parts

-

1k+ parts

$3.995

10k+ parts

-

357

$4.439

-

$3.995

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MKK Technologies

India . 1,581 parts In-Stock

1+ parts

$8.347

100+ parts

-

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10k+ parts

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1,581

$8.347

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DigiPath Technology Company

USA . 1,581 parts In-Stock

1+ parts

$8.347

100+ parts

-

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-

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1,581

$8.347

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Microchip USA

USA . 5,724 parts In-Stock

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5,724

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QUARKTWIN TECHNOLOGY LTD

USA . 3,709 parts In-Stock

1+ parts

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3,709

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Corphita

USA . 2,990 parts In-Stock

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2,990

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Parana Technologies

USA . 799 parts In-Stock

1+ parts

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100+ parts

$5.308

1k+ parts

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799

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$5.308

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Overview

Elevate your designs with the L6731B from STMicroelectronics, a powerhouse in switching regulators renowned for exceptional quality and reliability. This compact, high-performance solution delivers outstanding efficiency and versatility, making it ideal for various applications from consumer electronics to industrial automation. Benefit from ST’s commitment to innovation and excellence, ensuring your projects achieve optimal performance while reducing energy costs. Choose L6731B for unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern PCBs, optimizing space and enabling automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient space utilization on the board and can be easily aligned during mounting.

No. of Terminals: 16

With 16 terminals, the regulator provides multiple connection options, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style guarantees a compact design with effective thermal management options, essential for high-performance applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this product robust enough to handle demanding environments, ensuring reliability.

Control Mode: VOLTAGE-MODE

Utilizing a voltage-mode control allows for simpler control schemes and stability, making it ideal for a variety of power conversion applications.

Minimum Operating Temperature: -25 °C

The wide operating temperature range makes this regulator suitable for use in extreme conditions, ensuring reliable performance.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility and convenience in circuit design, allowing for better component placement.

Maximum Seated Height: 1.2 mm

A low maximum seated height supports high-density designs, crucial for compact electronic devices.

Width: 4.4 mm

The narrow width facilitates placement in tight spaces on PCBs, further aiding miniaturization of electronic systems.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it efficiently regulates voltage, making it suitable for use in power supplies where efficiency is crucial.

Length: 5 mm

A small length maintains compactness in circuit design, ideal for portable and space-constrained applications.

Maximum Switching Frequency: 500 kHz

A maximum switching frequency of 500 kHz allows for faster response times and improved power conversion efficiency.

Maximum Output Current: 20 A

Supporting a high maximum output current of 20A allows this regulator to handle substantial loads, making it suitable for high-power applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS processes, resulting in high speed and efficient performance.

Terminal Form: GULL WING

Gull wing terminal form ensures reliable soldering and electrical connection, minimizing the risk of failure in production.

Control Technique: PULSE WIDTH MODULATION

Pulse Width Modulation (PWM) control ensures efficiency in power delivery and enhances output stability, vital for various applications.

Switcher Config: BUCK

With a buck switcher configuration, it efficiently steps down voltage, making it ideal for battery-powered devices and power management applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tighter integration on PCBs while still ensuring appropriate spacing for soldering.

Minimum Input Voltage: 1.8 V

The capability to accept a minimum input voltage of 1.8V broadens its application range, particularly in low-voltage systems.

Maximum Input Voltage: 14 V

Handling a maximum input voltage of 14V provides flexibility in different operating conditions, enhancing the product's versatility.

Technical Specifications

Switching Regulators & Controllers L6731B attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

L6731B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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