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L6730CTR

STMicroelectronics

L6730CTR by STMicroelectronics

L6730CTR by STMicroelectronics is a compact switching regulator designed for industrial applications, featuring a max output current of 20 A and a switching frequency of up to 1 MHz. It operates in a temperature range from -40 °C to 85°C, ensuring reliability. This voltage-mode controller supports input voltages from 1.8 V to 14 V, making it versatile for various power management needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,854 parts In-Stock

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4,854

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Anansix

USA . 1,322 parts In-Stock

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1,322

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Digiode

USA . 798 parts In-Stock

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798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 747 parts In-Stock

1+ parts

$11.472

100+ parts

-

1k+ parts

$10.325

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747

$11.472

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$10.325

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MKK Technologies

India . 1,964 parts In-Stock

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$21.573

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1,964

$21.573

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$21.573

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1,964

$21.573

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Component Stockers USA

USA . 616 parts In-Stock

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$99.990

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616

$99.990

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Vigor

Singapore . 10,000 parts In-Stock

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10,000

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Microchip USA

USA . 5,864 parts In-Stock

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5,864

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Corphita

USA . 1,361 parts In-Stock

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1,361

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Parana Technologies

USA . 1,027 parts In-Stock

1+ parts

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$13.717

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1,027

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$13.717

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Overview

Unlock unparalleled efficiency and reliability in your designs with the L6730CTR from STMicroelectronics. Renowned for quality, STMicroelectronics delivers this advanced switching regulator, ideal for industrial applications where precision is key. With its compact design and robust thermal performance, the L6730CTR ensures seamless operation even in demanding environments. Experience enhanced energy savings and superior performance, empowering your projects to soar to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using durable plastic/epoxy materials ensures reliability and longevity of the product in various environments.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout and placement.

No. of Terminals: 20

With 20 terminals, this component supports various circuitry needs, providing flexibility for design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style promotes efficient heat dissipation, enhancing performance during operation.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures the product can function in high-heat environments without failure.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stable operation and is ideal for a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product suitable for harsh environments, including outdoor applications.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances design flexibility.

Maximum Seated Height: 1.2 mm

A low profile at 1.2 mm allows for space-efficient designs and suitability for compact applications.

Width: 4.4 mm

Narrow width allows for higher density in circuit designs, making it easier to fit in tight spaces.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it efficiently regulates power, providing better performance than linear regulators.

Length: 6.5 mm

The short length facilitates easy integration into various circuits without overwhelming board space.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product is designed for reliability in tough conditions.

Maximum Switching Frequency: 1000 kHz

High switching frequency allows for smaller passive components, contributing to a compact overall design.

Maximum Output Current: 20 A

Support for a maximum output current of 20 A ensures powerful performance for demanding applications.

Technology: BICMOS

BICMOS technology offers the advantages of both bipolar and CMOS technologies, enhancing performance.

Terminal Form: GULL WING

Gull wing terminal form provides good soldering surface area, ensuring reliable connections.

Control Technique: PULSE WIDTH MODULATION

PWM control technique improves efficiency and ensures precise regulation of output voltage.

Switcher Config: BUCK

Buck configuration allows for efficient voltage stepping down, making it ideal for power supply applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is suitable for modern PCB designs, allowing for more compact assemblies.

Minimum Input Voltage: 1.8 V

A low minimum input voltage of 1.8 V broadens the range of compatible power sources for flexibility.

Maximum Input Voltage: 14 V

Supporting a maximum input voltage of 14 V allows for versatility in various power supply scenarios.

Technical Specifications

Switching Regulators & Controllers L6730CTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

L6730CTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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