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L6730BTR

STMicroelectronics

L6730BTR by STMicroelectronics

L6730BTR by STMicroelectronics is a versatile buck switching regulator with a max output current of 20 A and operates b/w 1.8 V to 14 V. It features a compact design (4.4 mm x 6.5 mm) and supports PWM control for efficient voltage regulation. Ideal for applications requiring high efficiency in tight spaces, it withstands temps from -25 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,985 parts In-Stock

1+ parts

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3,985

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Anansix

USA . 2,485 parts In-Stock

1+ parts

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100+ parts

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2,485

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Digiode

USA . 2,369 parts In-Stock

1+ parts

-

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10k+ parts

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2,369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 196 parts In-Stock

1+ parts

$4.013

100+ parts

-

1k+ parts

-

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196

$4.013

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IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$4.310

100+ parts

-

1k+ parts

$3.879

10k+ parts

-

327

$4.310

-

$3.879

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MKK Technologies

India . 471 parts In-Stock

1+ parts

$8.105

100+ parts

-

1k+ parts

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10k+ parts

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471

$8.105

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-

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DigiPath Technology Company

USA . 471 parts In-Stock

1+ parts

$8.105

100+ parts

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10k+ parts

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471

$8.105

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Vigor

Singapore . 7,500 parts In-Stock

1+ parts

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100+ parts

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7,500

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Corphita

USA . 3,717 parts In-Stock

1+ parts

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3,717

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Parana Technologies

USA . 2,211 parts In-Stock

1+ parts

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100+ parts

$5.154

1k+ parts

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2,211

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$5.154

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Overview

Unlock unparalleled efficiency and performance with the L6730BTR from STMicroelectronics, a trusted leader in innovative electronic solutions. This advanced switching regulator boasts a compact design, ideal for high-density applications while delivering superior thermal management and reliability. Perfect for power-sensitive devices, the L6730BTR ensures seamless operation across diverse environments, enhancing your product's longevity and performance. Elevate your designs with this premium component that embodies quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and cost-effective while providing adequate protection for electronic components.

Surface Mount: YES

Surface mount technology allows for compact designs and reduced circuit board space, making it ideal for modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the PCB, facilitating efficient layout and component arrangement.

No. of Terminals: 20

Having 20 terminals provides flexibility for various connections and configurations, accommodating diverse circuit designs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style supports heat dissipation and allows for compact assembly, crucial for high-performance applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers simplicity and stability in regulating output voltage, making it suitable for a wide range of applications.

Minimum Operating Temperature: -25 °C

The wide temperature range allows the product to function in harsh conditions, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes ensure excellent conductivity and resistance to corrosion, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal position provides convenient access, facilitating easier assembly and integration into designs.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a sleek profile, which is advantageous for space-constrained applications.

Width: 4.4 mm

A narrow width allows for efficient utilization of PCB space, enabling more compact designs.

Other IC Type: SWITCHING CONTROLLER

As a switching controller, it delivers high efficiency and reduces heat generation, which is beneficial for power management.

Nominal Input Voltage: 12 V

A standard nominal input voltage makes it suitable for common power supply systems, simplifying integration.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum reflow time of 40 seconds ensures component integrity during assembly, promoting reliable performance.

Peak Reflow Temperature: 260 C

Sustaining high temperatures during reflow soldering enhances compatibility with various soldering processes.

Length: 6.5 mm

A compact length aids in fitting the component into tight spaces on PCBs, increasing design flexibility.

Maximum Switching Frequency: 1000 kHz

A maximum switching frequency of 1000 kHz enables high efficiency and optimal response in power conversion applications.

Maximum Output Current: 20 A

Supporting up to 20 A of output current makes this product suitable for high-power applications.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, enabling high speed with low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering, enhancing reliability in assembly.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers efficient energy conversion and precise regulation of output voltage and current.

Switcher Config: BUCK

As a buck switcher, it efficiently steps down voltage, making it ideal for battery-powered devices or systems.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for compact designs while maintaining ease of soldering for reliability.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suggesting careful handling is required during assembly.

Minimum Input Voltage: 1.8 V

A low minimum input voltage expands application compatibility, allowing use in various low-voltage environments.

Maximum Input Voltage: 14 V

A high maximum input voltage provides flexibility in power supply choices, making it broadly applicable in different systems.

Technical Specifications

Switching Regulators & Controllers L6730BTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

1.8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

L6730BTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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