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HCF4081BEY

STMicroelectronics

HCF4081BEY by STMicroelectronics

HCF4081BEY by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 3-20V, with a propagation delay of 250ns. Ideal for military-grade applications requiring reliable logic operations in a compact IN-LINE package.

Median Price

$0.845

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.151

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10

$0.151

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Component Electronics Inc.

Canada . 30 parts In-Stock

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$1.540

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$1.150

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$1.000

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Vyrian

USA . 6,929 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,163 parts In-Stock

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Anansix

USA . 1,355 parts In-Stock

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EZ Electronic Parts

Israel . 524 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 275 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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Inventory MP

USA . 65 parts In-Stock

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Bristol Electronics

USA . 65 parts In-Stock

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Semi Source

USA . 55 parts In-Stock

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55

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Prism Electronics

USA . 10 parts In-Stock

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EMSNET

USA . 7 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.151

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$0.143

10k+ parts

$0.140

100

$0.151

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$0.143

$0.140

AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$5.008

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668

$5.008

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$14.000

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669

$14.000

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IDEA Electronic Components Group

UK . 534 parts In-Stock

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$26.142

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$23.528

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MKK Technologies

India . 2,304 parts In-Stock

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$49.158

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$49.158

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DigiPath Technology Company

USA . 2,304 parts In-Stock

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$49.158

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Perfect Parts

USA . 6,256 parts In-Stock

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Microchip USA

USA . 5,362 parts In-Stock

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Corphita

USA . 3,958 parts In-Stock

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Lixinc

USA . 1,913 parts In-Stock

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Parana Technologies

USA . 1,293 parts In-Stock

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$31.256

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 1,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,000 parts In-Stock

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Kepictronics

USA . 477 parts In-Stock

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477

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Cyclops Electronics Ltd (Excess)

UK . 275 parts In-Stock

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Assy Fe

Spain . 24 parts In-Stock

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Overview

Looking for high-quality logic gates that deliver reliable performance? Look no further than the HCF4081BEY by STMicroelectronics. With a reputation for excellence, STMicroelectronics is a leading manufacturer in the industry. This versatile product offers 4 functions, 2 inputs, and a fast propagation delay of just 250 ns, making it ideal for a wide range of applications. Whether you're designing industrial equipment, consumer electronics, or automotive systems, this logic gate provides exceptional value, efficiency, and precision. Upgrade your projects with the HCF4081BEY and experience the benefits of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection and durability for the logic gates, making them suitable for various applications.

Propagation Delay At Nominal Supply: 250 ns

With a relatively low propagation delay, these logic gates can operate quickly and efficiently in electronic circuits.

No. of Functions: 4

The multiple functions offered by these logic gates make them versatile and capable of handling complex logic operations.

No. of Inputs: 2

With 2 input channels, these logic gates can process and analyze data from two different sources simultaneously.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and placement within electronic circuits.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage makes these logic gates compatible with a wide range of existing electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient performance and minimizes power consumption for the logic gates.

Power Supplies (V): 5/15

Compatible with both 5V and 15V power supplies, providing flexibility for different electronic applications.

No. of Terminals: 14

The 14 terminals offer ample connection points for integrating the logic gates into electronic circuits.

Package Style (Meter): IN-LINE

The in-line package style allows for efficient placement and space-saving design within electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand heat stress and operate reliably in various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and durability for reliable connection points in electronic circuits.

Terminal Position: DUAL

The dual terminal position offers flexibility for installation and connectivity options in electronic systems.

Maximum Seated Height: 5.1 mm

With a low seated height, these logic gates can be easily integrated into compact electronic designs.

Width: 7.62 mm

The narrow width makes these logic gates suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 3V

With a low minimum supply voltage, these logic gates can operate efficiently in low-power electronic systems.

Temperature Grade: MILITARY

Designed to meet military-grade standards, ensuring reliability and durability in harsh operating environments.

Technology: CMOS

The complementary metal-oxide-semiconductor technology used in these logic gates offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides reliable and sturdy connections for the logic gates in electronic circuits.

Packing Method: TUBE

The tube packing method ensures convenient storage and handling of the logic gates during shipping and installation.

Terminal Pitch: 2.54 mm

With a standard terminal pitch, these logic gates can be easily integrated into various electronic systems.

Maximum Supply Voltage (Vsup): 20V

With a high maximum supply voltage, these logic gates can handle power fluctuations and spikes without damage.

Technical Specifications

Logic Gates HCF4081BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4081BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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