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HCF4053M013TR

STMicroelectronics

HCF4053M013TR by STMicroelectronics

HCF4053M013TR from STMicroelectronics is a 3-function, dual-channel single-ended multiplexer with a max operating temp of 125 °C. It operates at supply voltages b/w 3V and 20V, featuring low on-state resistance (1050Ω). Ideal for military applications, it ensures reliable signal switching in compact designs.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 8,230 parts In-Stock

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$0.390

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$0.390

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Vyrian

USA . 7,973 parts In-Stock

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Bristol Electronics

USA . 3,289 parts In-Stock

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3,289

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ComSIT Distribution GmbH

Germany . 2,942 parts In-Stock

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2,942

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Digiode

USA . 2,754 parts In-Stock

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2,754

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Quantum Digital Technology

USA . 2,496 parts In-Stock

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2,496

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LWI Electronics Inc

India . 2,440 parts In-Stock

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Anansix

USA . 1,012 parts In-Stock

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1,012

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Chip Stock

USA . 905 parts In-Stock

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905

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LIBRA Elektronik GmbH

Germany . 715 parts In-Stock

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715

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ACDS - Activité Composants Distribution Service

France . 548 parts In-Stock

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548

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J2 Sourcing AB

Sweden . 205 parts In-Stock

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Semi Source

USA . 29 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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$2.215

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101

$2.215

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AZTECH Wire

Italy . 307 parts In-Stock

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$8.680

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307

$8.680

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IDEA Electronic Components Group

UK . 1,942 parts In-Stock

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$17.125

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$15.412

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1,942

$17.125

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$15.412

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MKK Technologies

India . 208 parts In-Stock

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$32.202

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208

$32.202

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DigiPath Technology Company

USA . 208 parts In-Stock

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$32.202

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208

$32.202

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Native Components

USA . 846 parts In-Stock

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$50.280

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$48.269

846

$50.280

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$48.269

Northwest PG Solutions

USA . 1,996 parts In-Stock

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$55.308

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Perfect Parts

USA . 47,520 parts In-Stock

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47,520

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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GreenTree Electronics

Israel . 6,827 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,192 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,084 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,056 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Corphita

USA . 1,455 parts In-Stock

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Glotronic Ltd.

UK . 1,017 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 544 parts In-Stock

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$20.475

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544

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$20.475

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Overview

Unlock the potential of your designs with the HCF4053M013TR from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers an exceptional multiplexer that enhances performance and reliability in demanding applications. With its robust construction and superior switching capabilities, this device is perfect for precision signal routing in military, automotive, and industrial sectors. Elevate your projects with unmatched efficiency and durability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Support for surface mount technology allows for easy integration into compact designs and efficient use of PCB space.

No. of Functions: 3

With three functions, this multiplexer can handle multiple signals, giving designers flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package enables efficient space utilization on PCBs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes this component compatible with standard logic levels, enhancing its usability.

Power Supplies (V): 5/15

Flexible power supply options (5V and 15V) allow for versatile applications in different circuit configurations.

No. of Terminals: 16

Having 16 terminals offers multiple connection points for various functionalities, enhancing circuit complexity and capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for high-density applications, saving valuable board space.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Ability to operate at very low temperatures makes it suitable for applications in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures good electrical conductivity and corrosion resistance, contributing to longevity.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in layout design and optimized signal integrity.

Maximum Seated Height: 1.75 mm

A low maximum seated height allows for compact designs with minimal height restrictions.

Width: 3.9 mm

A narrow width makes it suitable for densely packed boards where space is at a premium.

Other IC type: SINGLE-ENDED MULTIPLEXER

This configuration simplifies signal routing and reduces complexity in circuit design.

Minimum Supply Voltage (Vsup): 3 V

Operating down to a minimum of 3V expands the range of applications for low-power designs.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable reflow time ensures compatibility with standard assembly processes in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability facilitates compatibility with lead-free soldering processes.

Maximum On-state Resistance (Ron): 1050 ohm

A moderate on-state resistance balances power consumption and signal integrity in multiplexer operation.

Maximum Switch-on Time: 720 ns

Fast switch-on time allows for high-speed applications and reduces latency in signal processing.

Length: 9.9 mm

An optimal length contributes to compact designs without sacrificing performance.

Maximum Switch-off Time: 450 ns

Quick switch-off time aids in minimizing delays and ensuring accurate signal timing.

Temperature Grade: MILITARY

The military-grade specification indicates high reliability under extreme conditions, suitable for critical applications.

Maximum Supply Current (Isup): 0.6 mA

Low supply current enhances energy efficiency, making the component suitable for battery-operated devices.

No. of Channels: 2

Having two channels allows for simultaneous routing of multiple signals, increasing functionality.

Technology: MOS

MOS technology contributes to lower power consumption and faster switching speeds compared to other technologies.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and facilitate easier soldering during assembly.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compatibility with a wide range of PCB designs and layouts.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates a moderate sensitivity to moisture, providing guidelines for safe handling and storage.

Maximum Supply Voltage (Vsup): 20 V

The ability to handle a maximum supply voltage of 20V adds versatility for various circuit designs.

Maximum Signal Current: 0.01 A

A maximum signal current rating of 10 mA enables the device to support a wide range of applications.

Switching: BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits, enhancing reliability in signal path management.

Nominal On-state Resistance Match: 10 ohm

A nominal on-state resistance match of 10 ohm ensures consistent performance across multiple devices, enhancing system reliability.

Technical Specifications

Multiplexers & Switches HCF4053M013TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

450 ns

Maximum Switch-on Time:

720 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

MOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

HCF4053M013TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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