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HCF4016M013TR

STMicroelectronics

HCF4016M013TR by STMicroelectronics

HCF4016M013TR by STMicroelectronics is a versatile 4-function SPST multiplexer with a 5V nominal voltage. It operates in extreme temperatures from -55 °C to 125 °C and features a max on-state resistance of 660Ω. Ideal for military applications, it offers reliable performance in compact designs.

Median Price

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8

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1k+

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Chip Stock

USA . 16,745 parts In-Stock

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Pegasus Components GmbH

Germany . 12,500 parts In-Stock

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Digiode

USA . 4,031 parts In-Stock

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Vyrian

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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Electronics Depot

USA . 2,496 parts In-Stock

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Anansix

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LWI Electronics Inc

India . 244 parts In-Stock

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Native Components

USA . 100 parts In-Stock

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$0.271

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$0.260

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Northwest PG Solutions

USA . 659 parts In-Stock

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$0.298

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$0.262

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IDEA Electronic Components Group

UK . 191 parts In-Stock

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$18.353

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$16.518

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AZTECH Wire

Italy . 850 parts In-Stock

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$21.290

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$24.923

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MKK Technologies

India . 2,266 parts In-Stock

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$34.512

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DigiPath Technology Company

USA . 2,266 parts In-Stock

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$34.512

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GreenTree Electronics

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 13,755 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,061 parts In-Stock

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Microchip USA

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Alle Elektronik GmbH

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Corphita

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Perfect Parts

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Parana Technologies

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Overview

Unlock unparalleled performance and reliability with the HCF4016M013TR multiplexer from STMicroelectronics! Renowned for its high-quality standards, STMicroelectronics ensures this versatile component excels in demanding applications, from automotive to industrial automation. With its robust design, low power consumption, and impressive temperature range, the HCF4016M013TR delivers exceptional value that empowers your projects and enhances overall efficiency. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides excellent protection and reliability, making this multiplexer suitable for harsh environments.

Surface Mount: YES

Being a surface mount device allows for easy integration onto PCBs, saving space and facilitating automated assembly.

No. of Functions: 4

With four functions, this multiplexer can handle multiple signal paths efficiently, optimizing circuit design and reducing component count.

Package Shape: RECTANGULAR

The rectangular package shape ensures versatile placement on PCBs, accommodating different layout designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is common in many applications, making this device versatile for various digital circuits.

Power Supplies (V): 5/15

Supports both 5V and 15V power supplies, providing flexibility for different system architectures.

No. of Terminals: 14

The 14 terminals allow for comprehensive connectivity options, accommodating complex circuits and signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline design is ideal for compact devices, ensuring efficient use of space in tight arrangements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer is suitable for use in high-heat environments without risking failure.

Minimum Operating Temperature: -55 °C

The ability to operate down to -55 °C ensures reliable performance in extreme cold conditions, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal position provides versatile mounting options, facilitating easier PCB layout and design flexibility.

Output (V): SEPARATE OUTPUT

Separate output capability allows for independent signal handling, reducing crosstalk and improving performance.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial in designs where board space is at a premium and allows for more compact arrangements.

Width: 3.9 mm

A slim width allows integration into compact designs without requiring significant board real estate.

Other IC type: SPST

As a single-pole, single-throw (SPST) switch, it provides fundamental switching functionality necessary for basic circuit applications.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage makes this multiplexer compatible with battery-operated devices and low-power applications.

Minimum Negative Supply Voltage (Vsup): -1.5 V

Operating at a minimum negative supply voltage enhances flexibility for handling various signal types.

Maximum Time At Peak Reflow Temperature: 40 s

The ability to withstand up to 40 seconds at peak reflow temperature ensures reliability during manufacturing processes.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature capability allows compatibility with modern assembly processes and materials.

Maximum On-state Resistance (Ron): 660 ohm

A maximum on-state resistance of 660 ohm ensures minimal signal loss, thus enhancing the switching performance.

Maximum Switch-on Time: 100 ns

With a fast switch-on time, this multiplexer supports high-speed operations ideal for demanding digital applications.

Length: 8.65 mm

A moderate length facilitates easier placement in standard PCB layouts while maintaining compact configurations.

Temperature Grade: MILITARY

With military-grade specifications, this device is built for reliability in high-performance and critical applications.

Technology: MOS

Using MOS technology results in lower power consumption and fast switching speeds, enhancing overall efficiency.

Terminal Form: GULL WING

Gull wing terminals provide improved mechanical stability and make soldering easier during assembly.

Maximum Negative Supply Voltage (Vsup): -10 V

Supporting a maximum negative supply voltage of -10V allows for versatile signal handling, especially in analog applications.

Nominal Negative Supply Voltage (Vsup): -5 V

A nominal negative supply voltage of -5V is beneficial for a wide range of applications requiring dual supply operations.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm is compatible with a wide variety of PCB designs, simplifying integration.

Maximum Supply Voltage (Vsup): 10 V

Ability to handle up to 10V supply voltage makes this multiplexer versatile for many applications requiring higher voltages.

Nominal Off-state Isolation: 50 dB

An off-state isolation of 50 dB minimizes signal leakage when the switch is off, enhancing performance in sensitive applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits by ensuring that connections are switched cleanly, improving reliability.

Nominal On-state Resistance Match: 15 ohm

A nominal on-state resistance match of 15 ohm ensures consistent signal integrity and predictable performance across different channels.

Technical Specifications

Multiplexers & Switches HCF4016M013TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-10 V

Minimum Negative Supply Voltage (Vsup):

-1.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

660 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-on Time:

100 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

HCF4016M013TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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