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HCF4051BM

STMicroelectronics

HCF4051BM by STMicroelectronics

HCF4051BM by STMicroelectronics is an 8-channel single-ended multiplexer with CMOS technology. It operates at temperatures ranging from -40 to 85°C and has a power supply of 5/15V. This rectangular package with 16 terminals is ideal for industrial applications requiring break-before-make switching.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,727 parts In-Stock

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4,727

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Anansix

USA . 2,424 parts In-Stock

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2,424

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Vyrian

USA . 375 parts In-Stock

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375

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Pegasus Components GmbH

Germany . 80 parts In-Stock

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80

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Cogito LLC

Ukraine . 15 parts In-Stock

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15

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Q Components

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 878 parts In-Stock

1+ parts

$5.500

100+ parts

-

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$4.950

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878

$5.500

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$4.950

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MKK Technologies

India . 2,362 parts In-Stock

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$10.342

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2,362

$10.342

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DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$10.342

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2,362

$10.342

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AZTECH Wire

Italy . 591 parts In-Stock

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$13.018

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591

$13.018

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Lixinc

USA . 17,342 parts In-Stock

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17,342

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Corphita

USA . 3,677 parts In-Stock

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3,677

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Parana Technologies

USA . 1,407 parts In-Stock

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$6.576

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1,407

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$6.576

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience the seamless performance and reliability of the STMicroelectronics HCF4051BM multiplexer. Designed with precision and quality in mind, this versatile component offers a wide range of applications in various industries. Whether you're looking to enhance your electronic devices or streamline your operations, the HCF4051BM delivers unmatched value and efficiency. Trust in STMicroelectronics' reputation for excellence and harness the power of cutting-edge technology with this innovative solution.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability while keeping the weight of the product low.

Surface Mount:

YES - Allows for easy installation on PCBs without the need for additional hardware.

Package Shape:

RECTANGULAR - Makes it easy to integrate into existing electronics setups.

Power Supplies (V):

5/15 - Offers flexibility in power options for different applications.

No. of Terminals:

16 - Provides enough connections for various inputs and outputs.

Package Style (Meter):

SMALL OUTLINE - Saves space on the PCB, ideal for compact designs.

Maximum Operating Temperature:

85 °C - Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Makes it suitable for a wide range of operating conditions.

Terminal Finish:

Tin/Lead (Sn/Pb) - Ensures a secure connection and prevents corrosion.

Terminal Position:

DUAL - Allows for easy connection to other components.

Other IC type:

SINGLE-ENDED MULTIPLEXER - Offers versatility in signal routing for complex systems.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with demanding temperature requirements.

No. of Channels:

8 - Allows for routing multiple signals with ease.

Technology:

CMOS - Provides low power consumption and high-speed operation.

Terminal Form:

GULL WING - Facilitates easy soldering onto the PCB.

Terminal Pitch:

1.27 mm - Offers compatibility with standard PCB layouts.

Switching (V):

BREAK-BEFORE-MAKE - Prevents short circuits during switching operations.

Technical Specifications

Multiplexers & Switches HCF4051BM attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HCF4051BM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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