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CD74HC4051M96E4

Texas Instruments

CD74HC4051M96E4 by Texas Instruments

CD74HC4051M96E4 by Texas Instruments is a CMOS multiplexer with 16 terminals, operating from -55 to 125 °C. It has a max on-state resistance of 270 ohm and switching time of 32 ns. Ideal for military-grade applications requiring high bandwidth and low power consumption.

Median Price

$1.046

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 100 parts In-Stock

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$1.046

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$0.994

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$0.994

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$1.046

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Digiode

USA . 2,190 parts In-Stock

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$0.994

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Chip Stock

USA . 96,500 parts In-Stock

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Vyrian

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Nova Conductors

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Bristol Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$0.890

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$0.890

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Semicontronic

India . 100 parts In-Stock

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$0.890

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$0.868

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$0.863

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Corphita

USA . 4,451 parts In-Stock

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$0.941

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.046

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$0.994

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$0.994

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$1.046

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Parana Technologies

USA . 260 parts In-Stock

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$6.450

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$7.193

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AZTECH Wire

Italy . 281 parts In-Stock

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DigiPath Technology Company

USA . 2,285 parts In-Stock

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$6.534

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ChromeModa Solutions

Germany . 6,330 parts In-Stock

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$7.247

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$5.943

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IDEA Electronic Components Group

UK . 856 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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Metaverse IC Inc.

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iodParts Technologies Inc.

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Argo Parts USA

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Bastille Electronics

Australia . 88 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality CD74HC4051M96E4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative components for various applications. The CD74HC4051M96E4, belonging to the Multiplexers & Switches category, offers customers exceptional value with its versatile features and benefits. From its compact package style to its efficient performance, this product ensures seamless integration and optimal functionality. Upgrade your projects today with the Texas Instruments CD74HC4051M96E4 and experience top-notch quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal supply voltage for stable and efficient operation of the multiplexer.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the product.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for a wide range of operating environments.

Terminal Pitch: 1.27 mm

The close terminal pitch allows for compact design and efficient use of space on the circuit board.

Temperature Grade: MILITARY

Meets stringent military specifications for reliability and durability in harsh conditions.

Maximum On-state Resistance (Ron): 270 ohm

Low on-state resistance ensures minimal signal loss and accurate transmission.

Technical Specifications

Multiplexers & Switches CD74HC4051M96E4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY

Other IC type:

Nominal Bandwidth:

200 kHz

Maximum Input Voltage:

6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

73 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

270 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

1.58 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

32 ns

Maximum Switch-on Time:

32 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.91 mm

Trade Compliance

CD74HC4051M96E4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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