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HCF4052BE

STMicroelectronics

HCF4052BE by STMicroelectronics

HCF4052BE by STMicroelectronics is a CMOS differential multiplexer with 4 channels. It operates at -40 to 85 °C, powered by 5/15V supplies. The IC's through-hole package has 16 terminals and uses tin/lead finish, suitable for industrial applications.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

32

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TEDSS.com

USA . 626 parts In-Stock

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Anansix

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Vyrian

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Digiode

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Pegasus Components GmbH

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ComSIT Distribution GmbH

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MRC Electronics

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Rebound Electronics

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J2 Sourcing AB

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Pride Electronics

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Corel Iberica Componentes, S.L.

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Mil-Aero Solutions, Inc.

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Diverse Electronics

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PC Components Company LLC

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LWI Electronics Inc

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Prism Electronics

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Fibra_Brandt Electronic GMBH

Germany . 20 parts In-Stock

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Goldney Electronics S.L.

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Microfarads

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Cyclops Electronics Ltd

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NAC Semi

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Whistler Technology

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Sinequanon

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Native Components

USA . 137 parts In-Stock

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Northwest PG Solutions

USA . 2,213 parts In-Stock

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

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MKK Technologies

India . 2,017 parts In-Stock

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DigiPath Technology Company

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 4,770 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 2,028 parts In-Stock

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Parana Technologies

USA . 1,986 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,352 parts In-Stock

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Assy Fe

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Overview

Upgrade your electronics projects with the high-quality HCF4052BE from STMicroelectronics. Designed for reliability and performance, this multiplexer offers seamless switching between multiple channels with ease. Ideal for a wide range of applications, from audio equipment to industrial machinery, this component is a game-changer in circuit design. Trust STMicroelectronics' reputation for excellence and innovation to bring value and efficiency to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for use in various industrial applications.

Power Supplies (V): 5/15

The product can operate within a wide range of power supplies, providing flexibility and compatibility with different systems.

No. of Terminals: 16

With 16 terminals, this product offers multiple connection options, allowing for complex circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand heat without compromising performance.

Technology: CMOS

The CMOS technology used in this product results in low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Multiplexers & Switches HCF4052BE attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

NO

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4052BE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-15-068-2723, 5962150682723

NIIN

150682723

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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