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HCF4051BE

STMicroelectronics

HCF4051BE by STMicroelectronics

HCF4051BE by STMicroelectronics is an 8-channel single-ended multiplexer with CMOS technology. It operates at temperatures ranging from -40 to 85°C and supports power supplies of 5/15V. The package style is in-line, making it suitable for industrial applications requiring precise signal switching.

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

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Freelance Electronics

USA . 360 parts In-Stock

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$0.551

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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ComSIT Distribution GmbH

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Anansix

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Vyrian

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Digiode

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Pegasus Components GmbH

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R&J Components

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Mil-Aero Solutions, Inc.

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ECAB

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J2 Sourcing AB

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LWI Electronics Inc

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Mentor Electronics Marketing, LLC

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Sinequanon

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Rebound Electronics

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Prism Electronics

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Nova Conductors

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Resion

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MRC Electronics

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Corel Iberica Componentes, S.L.

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EPE Components Inc.

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Bristol Electronics

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Sogenti Electronics

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Holdelec - ElecDif-Pro

France . 15 parts In-Stock

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M&R Communications

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Ack Elektronik San.Tic.Ltd.Sti

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Standard Data Resources

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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Manoshevitz Elec. Sales

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Component Sense

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NAC Semi

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

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$5.350

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IDEA Electronic Components Group

UK . 1,710 parts In-Stock

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MKK Technologies

India . 1,447 parts In-Stock

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$11.691

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DigiPath Technology Company

USA . 1,447 parts In-Stock

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Lixinc

USA . 19,942 parts In-Stock

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Corphita

USA . 4,482 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,934 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,956 parts In-Stock

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Argo Parts USA

USA . 1,832 parts In-Stock

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Parana Technologies

USA . 1,324 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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Continental Prestige Electronics

USA . 571 parts In-Stock

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Kepictronics

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Perfect Parts

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Assy Fe

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Cyclops Electronics Ltd (Excess)

UK . 122 parts In-Stock

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Eliminating Global Boundries, Inc

USA . 75 parts In-Stock

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FE SAS

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Overview

Upgrade your electronic projects with the high-quality HCF4051BE by STMicroelectronics. This versatile multiplexer offers 8 channels for seamless signal routing, ideal for a wide range of applications in industrial settings. With a durable plastic/epoxy package body and reliable tin lead terminals, this product ensures long-lasting performance even in harsh conditions. Trust STMicroelectronics' expertise in semiconductor manufacturing to deliver top-notch quality and reliability. Experience the value and benefits of this versatile component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it a cost-effective choice.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing systems, saving space and time during installation.

Power Supplies (V): 5/15

This wide range of power supplies allows for versatile compatibility with different voltage requirements, making it a versatile solution.

No. of Terminals: 16

With 16 terminals, this product offers ample connection options for various applications, enhancing flexibility in use.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation process and provides a neat and organized appearance in the setup.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in extreme cold environments, providing reliability in diverse settings.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances conductivity and minimizes signal loss, ensuring optimal performance of the product.

Terminal Position: DUAL

Dual terminal positions offer redundancy and reliability in connections, reducing the risk of signal interruptions or failures.

Other IC type: SINGLE-ENDED MULTIPLEXER

The single-ended multiplexer design simplifies signal routing and management, making it an efficient choice for various signal processing applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in demanding industrial settings, making it a robust solution.

No. of Channels: 8

With 8 channels, this product supports multiple signal inputs and outputs, enabling versatile signal routing and processing capabilities.

Technology: CMOS

The CMOS technology utilized in this product offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections, minimizing the risk of signal loss or interference.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connection with standard cables and connectors, ensuring compatibility with existing setups.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents signal overlap or short circuits during transitions, ensuring smooth and reliable signal routing.

Technical Specifications

Multiplexers & Switches HCF4051BE attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

NO

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4051BE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-444-4308, 5962144444308

NIIN

144444308

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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