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HCF4051BC1

STMicroelectronics

HCF4051BC1 by STMicroelectronics

HCF4051BC1 by STMicroelectronics is an 8-channel single-ended multiplexer with a max on-state resistance of 280 ohm. It operates at a nominal voltage of 15 V and has a switching time of 240 ns. Ideal for industrial applications requiring precise signal routing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,448 parts In-Stock

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4,448

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Anansix

USA . 2,038 parts In-Stock

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2,038

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Digiode

USA . 254 parts In-Stock

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254

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$10.276

100+ parts

-

1k+ parts

$9.249

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204

$10.276

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$9.249

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Native Components

USA . 463 parts In-Stock

1+ parts

$15.597

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463

$15.597

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Northwest PG Solutions

USA . 1,508 parts In-Stock

1+ parts

$17.157

100+ parts

$15.441

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1,508

$17.157

$15.441

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MKK Technologies

India . 646 parts In-Stock

1+ parts

$19.324

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646

$19.324

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

$19.324

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646

$19.324

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Corphita

USA . 4,447 parts In-Stock

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4,447

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Parana Technologies

USA . 1,462 parts In-Stock

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$12.287

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1,462

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$12.287

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Overview

Unlock the power of versatile signal routing with the HCF4051BC1 by STMicroelectronics. Crafted with precision and quality, this multiplexer offers unparalleled performance in a compact chip carrier package. Ideal for a range of applications, from industrial automation to consumer electronics, this single-ended multiplexer boasts fast switching times and low on-state resistance. With its reliable operation and efficient design, the HCF4051BC1 delivers value and convenience to customers seeking high-quality solutions for their projects. Upgrade your system with the trusted technology of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 15 V

Operating at a higher voltage allows for greater versatility in applications where higher voltage requirements are needed.

No. of Channels: 8

Having 8 channels allows for multiple input signals to be managed efficiently, making this product suitable for complex systems.

Technology: CMOS

The use of CMOS technology enables low power consumption and high speed operation, making it a reliable choice for various electronic applications.

Maximum Signal Current: 0.01 A

With a high maximum signal current capacity, this product can handle robust signal levels without any issues, ensuring stable performance.

Technical Specifications

Multiplexers & Switches HCF4051BC1 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.9662 mm

Nominal Negative Supply Voltage (Vsup):

0 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

20

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

280 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Maximum Switch-off Time:

160 ns

Maximum Switch-on Time:

240 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.9662 mm

Trade Compliance

HCF4051BC1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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