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HCF4051M013TR

STMicroelectronics

HCF4051M013TR by STMicroelectronics

HCF4051M013TR from STMicroelectronics is an 8-channel single-ended multiplexer with a max supply voltage of 20V and operates b/w -55 °C to 125 °C. It features a low on-state resistance of 1050Ω and supports surface mount applications. Ideal for military-grade electronics, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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R&J Components

USA . 7,480 parts In-Stock

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Vyrian

USA . 7,138 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 7,095 parts In-Stock

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Avant Electronics Limited

UK . 5,000 parts In-Stock

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Bristol Electronics

USA . 4,030 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,683 parts In-Stock

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Inventory MP

USA . 2,867 parts In-Stock

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Anansix

USA . 2,325 parts In-Stock

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2,325

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J2 Sourcing AB

Sweden . 2,271 parts In-Stock

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Digiode

USA . 1,804 parts In-Stock

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Rebound Electronics

UK . 975 parts In-Stock

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Diverse Electronics

Canada . 900 parts In-Stock

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900

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Manoshevitz Elec. Sales

Israel . 700 parts In-Stock

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700

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Cyclops Electronics Ltd

UK . 75 parts In-Stock

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75

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Distributors (Availability)

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Microchip USA

USA . 233 parts In-Stock

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$3.002

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

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$4.219

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$3.797

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MKK Technologies

India . 1,832 parts In-Stock

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$7.934

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DigiPath Technology Company

USA . 1,832 parts In-Stock

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$7.934

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AZTECH Wire

Italy . 50 parts In-Stock

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$16.230

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,459 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,639 parts In-Stock

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Kepictronics

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iodParts Technologies Inc.

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Corphita

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GreenTree Electronics

Israel . 1,857 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 1,857 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,857 parts In-Stock

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Parana Technologies

USA . 1,228 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Unlock exceptional performance with the HCF4051M013TR from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics offers this versatile multiplexer ideal for a wide range of applications, from consumer electronics to industrial automation. With robust temperature tolerance and low on-state resistance, it ensures reliability and efficiency in any project. Experience seamless integration into your designs and elevate your innovations with a trusted component that delivers consistent excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various environments.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern circuits.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient space utilization on PCBs.

Nominal Supply Voltage (Vsup): 5 V

Standard nominal supply voltage makes it compatible with a wide range of applications.

Power Supplies (V): 5/15

Flexibility in power supply voltage enhances its versatility in different systems.

No. of Terminals: 16

A higher number of terminals allows for more connections and improved functionality.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-efficient and facilitate higher-density designs.

Maximum Operating Temperature: 125 °C

High operating temperature range makes it suitable for demanding applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature expands the operational range in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable terminal finish enhances connectivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position provides design flexibility and ease of layout.

Maximum Seated Height: 1.75 mm

Low seated height is ideal for minimalist designs and compact assemblies.

Width: 3.9 mm

Narrow width facilitates space-saving designs in crowded circuit boards.

Other IC type: SINGLE-ENDED MULTIPLEXER

Single-ended multiplexers are effective in simplifying signal routing in circuits.

Minimum Supply Voltage (Vsup): 3 V

Flexibility with lower supply voltage allows it to work in battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time ensures proper soldering without damaging the IC.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports compatibility with modern soldering processes.

Maximum On-state Resistance (Ron): 1050 ohm

While the on-state resistance is relatively high, it is manageable for many applications, ensuring signal integrity.

Maximum Switch-on Time: 720 ns

Fast switch-on time enhances overall system performance in dynamic applications.

Length: 9.9 mm

Compact length enables efficient layout and integration into tight spaces.

Maximum Switch-off Time: 450 ns

Quick switch-off time is beneficial for high-speed switching applications.

Temperature Grade: MILITARY

Military-grade components are designed for reliability in harsh operating environments.

Maximum Supply Current (Isup): 3 mA

Low supply current is ideal for power-sensitive applications, preserving battery life.

No. of Channels: 8

With 8 channels, it offers a versatile solution for various multiplexing needs.

Technology: MOS

MOS technology provides high speed and low power consumption, making it efficient for switch applications.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical connection and ease of soldering on PCBs.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, providing guidelines for handling and storage.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage allows for greater flexibility in various applications.

Maximum Signal Current: 0.01 A

Capable of handling moderate signal currents, suitable for many signal switching applications.

Switching (V): BREAK-BEFORE-MAKE

This switching method prevents signal contention, ensuring reliability in multiplexing scenarios.

Nominal On-state Resistance Match: 10 ohm

Tight on-state resistance matching ensures consistent performance across multiple channels.

Technical Specifications

Multiplexers & Switches HCF4051M013TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

450 ns

Maximum Switch-on Time:

720 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

MOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

HCF4051M013TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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