Loading...

HCF4052M013TR

STMicroelectronics

HCF4052M013TR by STMicroelectronics

HCF4052M013TR from STMicroelectronics is a 4-channel differential multiplexer with a max supply voltage of 20V and operates b/w -55 °C to 125 °C. It features low on-state resistance (1050Ω) and fast switching times (720ns). Ideal for military applications, it ensures reliable performance in demanding environments.

Median Price

$0.427

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 253 parts In-Stock

1+ parts

$0.427

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$0.427

-

-

-

Chip Stock

USA . 22,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,140

-

-

-

-

Bristol Electronics

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,750

-

-

-

-

Atlantic Semiconductor

USA . 8,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,739

-

-

-

-

Vyrian

USA . 5,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,178

-

-

-

-

Digiode

USA . 4,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,401

-

-

-

-

Semi Source

USA . 3,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,837

-

-

-

-

Anansix

USA . 2,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,263

-

-

-

-

Inventory MP

USA . 2,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,788

-

-

-

-

Ack Elektronik San.Tic.Ltd.Sti

. 1,593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,593

-

-

-

-

Goldney Electronics S.L.

Spain . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Avant Electronics Limited

UK . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 261 parts In-Stock

1+ parts

$2.393

100+ parts

-

1k+ parts

-

10k+ parts

-

261

$2.393

-

-

-

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$12.820

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$12.820

-

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$16.652

100+ parts

-

1k+ parts

$14.987

10k+ parts

-

93

$16.652

-

$14.987

-

MKK Technologies

India . 1,684 parts In-Stock

1+ parts

$31.313

100+ parts

-

1k+ parts

-

10k+ parts

-

1,684

$31.313

-

-

-

DigiPath Technology Company

USA . 1,684 parts In-Stock

1+ parts

$31.313

100+ parts

-

1k+ parts

-

10k+ parts

-

1,684

$31.313

-

-

-

Perfect Parts

USA . 8,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,075

-

-

-

-

Corphita

USA . 4,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,766

-

-

-

-

Alle Elektronik GmbH

Germany . 4,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,512

-

-

-

-

Kepictronics

USA . 3,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,550

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,354

-

-

-

-

Northwest PG Solutions

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

Assy Fe

Spain . 1,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,192

-

-

-

-

ChipstoGo Electronic ltd

UK . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Native Components

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

470

-

-

-

-

Parana Technologies

USA . 455 parts In-Stock

1+ parts

-

100+ parts

$19.910

1k+ parts

-

10k+ parts

-

455

-

$19.910

-

-

GreenTree Electronics

Israel . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Overview

Unlock innovation with the HCF4052M013TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This dual differential multiplexer delivers unmatched reliability and performance for diverse applications, from consumer electronics to industrial systems. With its compact design and robust temperature range, it ensures seamless integration and efficiency. Choose STMicroelectronics for unparalleled quality and elevate your projects with a trusted partner in technology advancement!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers excellent protection for the internal components, ensuring reliability in various environments.

Surface Mount: YES

The surface mount design enables efficient use of PCB space and simplifies assembly processes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and integration of the device on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal voltage of 5V ensures compatibility with a wide range of electronic devices.

Power Supplies (V): 5/15

This versatility in power supply options offers flexibility in system design.

No. of Terminals: 16

With 16 terminals, this device can support multiple connections, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space usage, making it suitable for compact designs.

Maximum Operating Temperature: 125 °C

This high temperature tolerance allows the device to function in harsh environments.

Minimum Operating Temperature: -55 °C

The capability to operate at low temperatures ensures reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions enhance the versatility of layouts on PCBs.

Maximum Seated Height: 1.75 mm

This low profile height is advantageous for low-profile designs and improves compatibility with other components.

Width: 3.9 mm

The compact width contributes to efficient space utilization on circuit boards.

Other IC type: DIFFERENTIAL MULTIPLEXER

This type allows for the combination and routing of multiple signals, enhancing data handling capabilities.

Minimum Supply Voltage (Vsup): 3 V

Supporting a minimum of 3V provides flexibility for battery-operated applications.

Maximum Time At Peak Reflow Temperature: 30 s

This accommodates various soldering processes, ensuring reliable assembly while preventing damage.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures compatibility with lead-free soldering processes.

Maximum On-state Resistance (Ron): 1050 ohm

This level of on-state resistance contributes to efficient signal performance, reducing power loss.

Maximum Switch-on Time: 720 ns

Fast switching enhances system responsiveness and efficiency in high-speed applications.

Length: 9.9 mm

The length provides a compact solution suitable for space-constrained applications.

Maximum Switch-off Time: 450 ns

Quick switch-off times improve overall system performance and reduce latency.

Temperature Grade: MILITARY

This classification ensures reliability in military applications where performance under extreme conditions is critical.

Maximum Supply Current (Isup): 3 mA

Low supply current requirements make this device energy-efficient, leading to longer battery life in portable applications.

No. of Channels: 4

Four channels enable multiple signal processing in a single device, promoting design efficiency.

Technology: MOS

MOS technology allows for lower power consumption and faster switching speeds.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and enhance mechanical stability.

Terminal Pitch: 1.27 mm

This standard pitch is compatible with most PCB designs, simplifying integration.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates reasonable protection against humidity, suitable for most environments.

Maximum Supply Voltage (Vsup): 20 V

A high maximum supply voltage expands the range of applications and enhances power handling.

Maximum Signal Current: 0.01 A

This tolerance for signal current is suitable for a variety of low-power applications.

Switching (V): BREAK-BEFORE-MAKE

This switching method prevents short circuits, enhancing reliability in signal integrity.

Nominal On-state Resistance Match: 10 ohm

A small on-state resistance match ensures minimal signal distortion and better performance.

Technical Specifications

Multiplexers & Switches HCF4052M013TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

450 ns

Maximum Switch-on Time:

720 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

MOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

HCF4052M013TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20