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HCF4030BEY

STMicroelectronics

HCF4030BEY by STMicroelectronics

HCF4030BEY by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V, with a propagation delay of 280ns. Ideal for military-grade applications requiring high-speed signal processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,395 parts In-Stock

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Digiode

USA . 3,822 parts In-Stock

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3,822

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Anansix

USA . 2,243 parts In-Stock

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Semi Source

USA . 159 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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Microchip USA

USA . 261 parts In-Stock

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$0.379

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261

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AZTECH Wire

Italy . 1,198 parts In-Stock

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$20.270

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$20.270

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

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$31.011

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$27.910

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$31.011

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$27.910

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MKK Technologies

India . 1,385 parts In-Stock

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$58.315

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DigiPath Technology Company

USA . 1,385 parts In-Stock

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$58.315

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Metaverse IC Inc.

Canada . 22,550 parts In-Stock

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Perfect Parts

USA . 8,295 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,951 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,888 parts In-Stock

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$37.079

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Native Components

USA . 821 parts In-Stock

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Northwest PG Solutions

USA . 670 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the HCF4030BEY by STMicroelectronics, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this versatile component is ideal for a wide range of applications. With minimal propagation delay and a durable plastic/epoxy package body, this logic gate ensures efficient operation and long-lasting durability. Trust STMicroelectronics to provide you with the quality and functionality you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 280 ns

With a low propagation delay of 280 ns at nominal supply voltage, these logic gates can process signals quickly and efficiently.

No. of Functions: 4

Having 4 functions in one package allows for more complex logic operations to be performed without the need for additional components.

No. of Inputs: 2

With 2 input pins, these logic gates can accept multiple input signals and perform the necessary logical operations with ease.

Package Shape: RECTANGULAR

Rectangular package shape makes these logic gates easy to handle and integrate into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes these logic gates compatible with a wide range of electronic devices and circuits.

Load Capacitance (CL): 50 pF

Having a load capacitance of 50 pF ensures stable operation and prevents signal distortions in the circuit.

Power Supplies (V): 5/15

Supporting dual power supplies of 5V and 15V provides flexibility in voltage requirements for different circuit applications.

No. of Terminals: 14

With 14 terminals, these logic gates offer multiple connection points for interfacing with other components in a circuit.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, these logic gates can still function properly in extremely cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Maximum Seated Height: 5.1 mm

Low maximum seated height of 5.1 mm allows for compact and space-saving designs when integrating these logic gates into a circuit.

Width: 7.62 mm

With a width of 7.62 mm, these logic gates are compact and can easily fit into tight spaces within a circuit layout.

Minimum Supply Voltage (Vsup): 3 V

Ability to operate at a minimum supply voltage of 3V allows for energy-efficient operation in low-power electronic devices.

Temperature Grade: MILITARY

Military-grade temperature rating ensures that these logic gates can withstand extreme temperature conditions and harsh environments.

Technology: CMOS

CMOS technology used in these logic gates provides low power consumption, high noise immunity, and fast switching speeds for efficient operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure mounting on a PCB, ensuring reliable connections in the circuit.

Packing Method: TUBE

Packed in tubes for convenient storage and transportation, ensuring the integrity and protection of the logic gates during handling.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, these logic gates offer compatibility with standard PCB layouts and easy integration into circuit designs.

Maximum Supply Voltage (Vsup): 20 V

Support for a maximum supply voltage of 20V allows for compatibility with a wide range of power sources and flexibility in circuit design.

Technical Specifications

Logic Gates HCF4030BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4030BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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