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HCF4027M013TR

STMicroelectronics

HCF4027M013TR by STMicroelectronics

HCF4027M013TR by STMicroelectronics is a dual 2-bit CMOS latch with a max supply voltage of 20V and operates at temperatures from -55 °C to 125 °C. It features a propagation delay of 300 ns and supports frequencies up to 3.5 MHz. Ideal for military applications, it comes in a compact SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,630 parts In-Stock

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8,630

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Digiode

USA . 3,178 parts In-Stock

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3,178

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ComSIT Distribution GmbH

Germany . 1,455 parts In-Stock

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1,455

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Anansix

USA . 1,072 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 818 parts In-Stock

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$0.045

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$0.043

818

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$0.043

Microchip USA

USA . 263 parts In-Stock

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$3.045

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263

$3.045

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AZTECH Wire

Italy . 631 parts In-Stock

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$8.920

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631

$8.920

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IDEA Electronic Components Group

UK . 352 parts In-Stock

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$19.948

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$17.954

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352

$19.948

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$17.954

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MKK Technologies

India . 2,118 parts In-Stock

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$37.512

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DigiPath Technology Company

USA . 2,118 parts In-Stock

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$37.512

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$37.512

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Ampacity Inc.

Singapore . 1,192 parts In-Stock

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$60.000

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$60.000

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Corphita

USA . 3,904 parts In-Stock

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Northwest PG Solutions

USA . 2,320 parts In-Stock

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Parana Technologies

USA . 561 parts In-Stock

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$23.851

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Overview

Elevate your designs with the HCF4027M013TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile latch and flip-flop component enhances performance while ensuring reliability across various applications, from automotive to industrial control systems. Its compact, surface-mount design and robust temperature tolerance make it an ideal choice for demanding environments. Experience superior quality and seamless integration, empowering your projects for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides enhanced protection against environmental factors while maintaining lightweight characteristics, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, making it a cost-effective solution for modern electronic devices.

No. of Functions: 2

Having two functions allows for versatile usage in applications requiring multiple logic operations within a single package.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it easier to fit into various layouts.

No. of Bits: 2

A 2-bit design makes it suitable for handling a variety of logical data inputs, enhancing its functionality in digital circuits.

Nominal Supply Voltage / Vsup: 5 V

The standard 5V supply voltage is widely compatible with most digital circuits, simplifying integration into existing systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for optimized performance with minimal signal degradation, making it ideal for high-speed applications.

Power Supplies (V): 5/15

The flexibility in power supply options makes this product adaptable for different circuit requirements, ensuring versatility in application.

No. of Terminals: 16

With 16 terminals, this product provides ample connection points for extensive interfacing possibilities in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline design is beneficial for space-constrained applications, allowing for more compact and efficient electronics.

Propagation Delay (tpd): 300 ns

A propagation delay of 300 ns is adequate for many applications, balancing speed and reliability in data processing.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes it suitable for harsh environments, ensuring reliability in demanding applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise timing and synchronization in digital circuits, enhancing overall performance.

Minimum Operating Temperature: -55 °C

The capability to function in extremely low temperatures makes it suitable for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures excellent conductivity and corrosion resistance, improving long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB layout and design, providing options for efficient integration.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous in compact electronics, ensuring compatibility with slim designs.

Width: 3.9 mm

With a narrow width, it is easy to place this component in tight spaces on circuit boards, aiding in efficient layout design.

Output Polarity: COMPLEMENTARY

Complementary output allows for a wider range of logic operations, enhancing functionality in digital applications.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3V provides flexibility for battery-powered applications.

Length: 9.9 mm

A compact length is ideal for increasing circuit density without compromising performance or reliability.

Temperature Grade: MILITARY

MIL-grade components offer enhanced durability and reliability in critical applications, making them suitable for harsh conditions.

Maximum Frequency At Nominal Supply: 3500000 Hz

A high maximum frequency allows for high-speed data processing applications, making it suitable for modern communication systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, which is crucial for today’s energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve electrical connection reliability in surface mount applications.

Packing Method: TR

Tape and reel packing is beneficial for automated assembly lines, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard in many applications, making it easy to integrate into existing layouts.

Minimum fmax: 12 MHz

The ability to operate at a minimum frequency of 12 MHz provides flexibility for a range of digital applications.

Maximum Supply Voltage (Vsup): 20 V

A high maximum supply voltage enables its use in diverse high-voltage applications, broadening its utility in different environments.

Technical Specifications

Latches & Flip-Flops HCF4027M013TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5/15

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

12 MHz

Trade Compliance

HCF4027M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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