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HCF4011BEY

STMicroelectronics

HCF4011BEY by STMicroelectronics

HCF4011BEY by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 3-15V, with a propagation delay of 250ns. This IC is commonly used in industrial applications requiring reliable logic operations within the temperature range of -40 to 85°C.

Median Price

$1.920

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 18 parts In-Stock

1+ parts

$1.920

100+ parts

$1.440

1k+ parts

$1.250

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18

$1.920

$1.440

$1.250

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Vyrian

USA . 11,432 parts In-Stock

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Digiode

USA . 2,001 parts In-Stock

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2,001

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Anansix

USA . 1,390 parts In-Stock

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1,390

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ComSIT Distribution GmbH

Germany . 1,012 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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LIBRA Elektronik GmbH

Germany . 101 parts In-Stock

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101

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Pegasus Components GmbH

Germany . 97 parts In-Stock

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GES GmbH

Germany . 51 parts In-Stock

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51

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EMSNET

USA . 47 parts In-Stock

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Holdelec - ElecDif-Pro

France . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 314 parts In-Stock

1+ parts

$3.979

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314

$3.979

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$13.802

100+ parts

$12.560

1k+ parts

$11.318

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350

$13.802

$12.560

$11.318

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AZTECH Wire

Italy . 262 parts In-Stock

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$14.483

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262

$14.483

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IDEA Electronic Components Group

UK . 512 parts In-Stock

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$28.590

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$25.731

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512

$28.590

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$25.731

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Ampacity Inc.

Singapore . 862 parts In-Stock

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$46.000

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862

$46.000

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MKK Technologies

India . 1,898 parts In-Stock

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$53.761

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1,898

$53.761

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DigiPath Technology Company

USA . 1,898 parts In-Stock

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$53.761

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$53.761

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Lixinc

USA . 8,484 parts In-Stock

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Corphita

USA . 2,666 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,276 parts In-Stock

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Perfect Parts

USA . 905 parts In-Stock

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905

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Parana Technologies

USA . 580 parts In-Stock

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$34.184

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$34.184

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GreenTree Electronics

Israel . 350 parts In-Stock

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350

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the power of seamless logic operations with the HCF4011BEY by STMicroelectronics. With an impressive lineup of 4 functions and 2 inputs, this logic gate delivers reliable performance with a propagation delay of just 250 ns. Ideal for industrial applications, this CMOS technology marvel boasts a wide temperature range from -40 to 85°C. STMicroelectronics' commitment to quality shines through in every aspect of this product, offering customers unparalleled value and benefits. Elevate your projects with the HCF4011BEY and experience excellence in logic gates like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply:

250 ns - Fast propagation delay allows for quick processing of signals.

No. of Functions:

4 - Provides versatility and flexibility in circuit design.

No. of Inputs:

2 - Suitable for basic logic gate operations.

Package Shape:

- **Nominal Supply Voltage / Vsup (V) 5 - Compatible with common supply voltages for ease of use.

Load Capacitance (CL):

50 pF - Supports efficient operation with various loads.

Power Supplies (V):

5/15 - Accommodates different power supply requirements.

No. of Terminals:

14 - Sufficient terminals for connecting to other components.

Package Style (Meter):

IN-LINE - Convenient form factor for compact circuit layouts.

Propagation Delay (tpd):

250 ns - Consistent delay across all operations for predictability.

Maximum Operating Temperature:

85 °C - Suitable for a wide range of operating environments.

Minimum Operating Temperature:

40 °C - Can function in harsh conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance and ensures long-term reliability.

Terminal Position:

DUAL - Allows for easy installation and connection to other components.

Maximum Seated Height:

5.1 mm - Low profile design for space-saving applications.

Width:

7.62 mm - Compact size for efficient use of PCB space.

Minimum Supply Voltage (Vsup):

3 V - Can operate at low voltages for energy efficiency.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with varying temperature conditions.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high performance.

Terminal Form:

THROUGH-HOLE - Easy to solder onto PCBs for secure connections.

Packing Method:

TUBE - Convenient packaging for storage and transportation.

Terminal Pitch:

2.54 mm - Standard pitch for compatibility with commonly used connectors.

Maximum Supply Voltage (Vsup):

15 V - Can handle high supply voltages for robust performance.

Technical Specifications

Logic Gates HCF4011BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4011BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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