Loading...

HCF4008BF

STMicroelectronics

HCF4008BF by STMicroelectronics

HCF4008BF by STMicroelectronics is a 4-bit digital arithmetic circuit with CMOS technology. It operates b/w -40 °C to 85°C, with power supplies of 3V to 15V. This IC comes in a ceramic rectangular package and is ideal for industrial applications requiring precise calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,765

-

-

-

-

Anansix

USA . 2,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,489

-

-

-

-

Digiode

USA . 1,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

-

-

-

-

ECAB

Sweden . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 769 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

$0.038

769

$0.040

-

-

$0.038

IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$25.176

100+ parts

-

1k+ parts

$22.658

10k+ parts

-

1,283

$25.176

-

$22.658

-

MKK Technologies

India . 1,185 parts In-Stock

1+ parts

$47.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$47.341

-

-

-

DigiPath Technology Company

USA . 1,185 parts In-Stock

1+ parts

$47.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$47.341

-

-

-

Corphita

USA . 3,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,802

-

-

-

-

Northwest PG Solutions

USA . 1,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

-

-

-

-

Parana Technologies

USA . 596 parts In-Stock

1+ parts

-

100+ parts

$30.102

1k+ parts

-

10k+ parts

-

596

-

$30.102

-

-

Overview

Elevate your digital arithmetic circuits with the HCF4008BF by STMicroelectronics. Crafted with precision and expertise, this high-quality product is designed to exceed expectations in a variety of applications. From industrial settings to everyday electronics, the HCF4008BF delivers unmatched performance and reliability. With its innovative technology and durable construction, this product offers customers unparalleled value and benefits. Trust STMicroelectronics to provide cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide high thermal conductivity and good resistance to extreme temperatures, ensuring the durability and reliability of the digital arithmetic circuit.

No. of Bits: 4

The 4-bit design allows for a moderate level of precision in calculations while keeping the circuit simple and cost-effective for various applications.

Power Supplies (V): 3/15

The flexibility of operating with power supplies ranging from 3V to 15V allows for compatibility with a wide range of systems and devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this digital arithmetic circuit efficient and reliable.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables the circuit to function reliably in demanding industrial environments without experiencing performance degradation.

Technical Specifications

Digital Arithmetic Circuits HCF4008BF attributes and parameters. Explore more Digital Arithmetic Circuits devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4008BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20