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HCF40101BM

STMicroelectronics

HCF40101BM by STMicroelectronics

HCF40101BM by STMicroelectronics is a CMOS digital arithmetic circuit with 14 terminals and power supplies of 3/15V. It operates in industrial temperature range (-40 to 85 °C) and features a small outline package for surface mount applications. Ideal for various electronic systems requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Standard Data Resources

USA . 1,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

-

-

-

-

Digiode

USA . 1,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

-

-

-

-

Anansix

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

921

-

-

-

-

Vyrian

USA . 217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

217

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 877 parts In-Stock

1+ parts

$0.128

100+ parts

-

1k+ parts

-

10k+ parts

$0.123

877

$0.128

-

-

$0.123

Northwest PG Solutions

USA . 1,805 parts In-Stock

1+ parts

$0.141

100+ parts

-

1k+ parts

-

10k+ parts

$0.124

1,805

$0.141

-

-

$0.124

IDEA Electronic Components Group

UK . 1,116 parts In-Stock

1+ parts

$15.473

100+ parts

-

1k+ parts

$13.925

10k+ parts

-

1,116

$15.473

-

$13.925

-

MKK Technologies

India . 813 parts In-Stock

1+ parts

$29.095

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$29.095

-

-

-

DigiPath Technology Company

USA . 813 parts In-Stock

1+ parts

$29.095

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$29.095

-

-

-

Corphita

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

-

-

-

-

Parana Technologies

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

$18.500

1k+ parts

-

10k+ parts

-

1,337

-

$18.500

-

-

Overview

Enhance your digital arithmetic circuits with the high-quality HCF40101BM from STMicroelectronics. Designed with precision and reliability in mind, this product offers a range of applications in various industries. With a focus on durability and performance, STMicroelectronics ensures that customers receive exceptional value and benefits from their products. Upgrade your projects with the HCF40101BM and experience the difference that top-notch technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable housing for the circuit, making it suitable for various applications.

Surface Mount: YES

Being surface mountable enables easy and efficient installation on printed circuit boards, saving space and allowing for automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor that can easily fit into existing designs and layouts.

Power Supplies (V): 3/15

The wide range of power supply options allows flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact electronic devices or applications with limited board real estate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments or under extended usage conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the circuit to function effectively in cold environments without risk of malfunction.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and electrical conductivity for secure connections on the PCB.

Terminal Position: DUAL

Dual terminal positions offer flexibility in board placement and orientation, accommodating different PCB layouts or design requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the circuit can withstand a wide range of operating temperatures, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making it a reliable choice for digital arithmetic circuits.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring secure and reliable connections.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and compact placement of terminals on the PCB, contributing to overall board efficiency and space savings.

Technical Specifications

Digital Arithmetic Circuits HCF40101BM attributes and parameters. Explore more Digital Arithmetic Circuits devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HCF40101BM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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