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HCF40101BE

STMicroelectronics

HCF40101BE by STMicroelectronics

HCF40101BE by STMicroelectronics is a CMOS digital arithmetic circuit with 14 terminals, operating b/w -40 to 85 °C. It has power supplies of 3/15V and uses Tin/Lead terminal finish. This rectangular package is ideal for industrial applications requiring precise calculations.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,010 parts In-Stock

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-

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3,010

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Anansix

USA . 870 parts In-Stock

1+ parts

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870

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Vyrian

USA . 504 parts In-Stock

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504

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Bristol Electronics

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$0.422

1k+ parts

$0.360

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495

-

$0.422

$0.360

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Ack Elektronik San.Tic.Ltd.Sti

. 15 parts In-Stock

1+ parts

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15

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ECAB

Sweden . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$21.436

100+ parts

-

1k+ parts

$19.292

10k+ parts

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1,888

$21.436

-

$19.292

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MKK Technologies

India . 928 parts In-Stock

1+ parts

$40.309

100+ parts

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928

$40.309

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DigiPath Technology Company

USA . 928 parts In-Stock

1+ parts

$40.309

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928

$40.309

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Corphita

USA . 4,266 parts In-Stock

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4,266

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Parana Technologies

USA . 1,605 parts In-Stock

1+ parts

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$25.630

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1,605

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$25.630

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Northwest PG Solutions

USA . 1,478 parts In-Stock

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1,478

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Native Components

USA . 499 parts In-Stock

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499

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Assy Fe

Spain . 175 parts In-Stock

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175

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Overview

Enhance your digital arithmetic circuits with the high-quality HCF40101BE from STMicroelectronics. Manufactured by a trusted leader in the industry, this product offers exceptional value and benefits for a wide range of applications. With a package body made of durable plastic/epoxy and a temperature range suitable for industrial use, this product is designed to deliver reliable performance in various environments. Upgrade your projects with the HCF40101BE and experience the advantages of superior technology and craftsmanship that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy stacking and compact arrangement in a circuit board, maximizing space efficiency.

Power Supplies (V): 3/15

Wide range of power supplies supported (3V to 15V) provides flexibility in usage and compatibility with different systems.

No. of Terminals: 14

Sufficient number of terminals (14) for connecting to various components and peripherals in a circuit.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into existing circuit designs and layouts.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables the product to function effectively in cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and electrical conductivity for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and orientation during installation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product's reliability and performance under demanding operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy and secure mounting on a circuit board for stable connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm ensures compatibility with common PCB layouts and facilitates easy soldering.

Technical Specifications

Digital Arithmetic Circuits HCF40101BE attributes and parameters. Explore more Digital Arithmetic Circuits devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF40101BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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