Loading...

HCF4008BE

STMicroelectronics

HCF4008BE by STMicroelectronics

HCF4008BE by STMicroelectronics is a 4-bit digital arithmetic circuit with a supply voltage range of 3-15V. It features an 800 ns propagation delay and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications, it comes in a dual in-line package.

Median Price

$1.870

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 20 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$1.870

-

-

-

Anansix

USA . 1,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,397

-

-

-

-

Vyrian

USA . 1,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

-

-

-

-

Carlin Systems, Inc.

USA . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

942

-

-

-

-

ComSIT Distribution GmbH

Germany . 508 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

508

-

-

-

-

Digiode

USA . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

104

-

-

-

-

ECAB

Sweden . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96

-

-

-

-

Standard Data Resources

USA . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38

-

-

-

-

LittleDiode

UK . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Fibra_Brandt Electronic GMBH

Germany . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

GES GmbH

Germany . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Ack Elektronik San.Tic.Ltd.Sti

. 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 171 parts In-Stock

1+ parts

$20.225

100+ parts

-

1k+ parts

$18.203

10k+ parts

-

171

$20.225

-

$18.203

-

MKK Technologies

India . 1,613 parts In-Stock

1+ parts

$38.032

100+ parts

-

1k+ parts

-

10k+ parts

-

1,613

$38.032

-

-

-

DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$38.032

100+ parts

-

1k+ parts

-

10k+ parts

-

1,613

$38.032

-

-

-

Corphita

USA . 3,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,003

-

-

-

-

Parana Technologies

USA . 1,425 parts In-Stock

1+ parts

-

100+ parts

$24.182

1k+ parts

-

10k+ parts

-

1,425

-

$24.182

-

-

Native Components

USA . 778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

778

-

-

-

-

Northwest PG Solutions

USA . 607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

607

-

-

-

-

Assy Fe

Spain . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

257

-

-

-

-

Perfect Parts

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Overview

Unleash the power of precision with the HCF4008BE by STMicroelectronics—your go-to solution for digital arithmetic circuits. Crafted from high-quality plastic/epoxy, this robust component guarantees reliability and performance in a variety of applications, from industrial automation to consumer electronics. With a wide operating temperature range and dual terminal design, it ensures versatility and ease of integration, providing exceptional value and efficiency that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliable performance and protection in various environments, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and integration into circuit boards, optimizing space utilization.

No. of Bits: 4

With a 4-bit architecture, the circuit can handle smaller data sizes effectively, ideal for low-power and compact digital applications.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V operation makes it compatible with many existing systems and simplifies design requirements.

Power Supplies (V): 3/15

Versatile power supply options (3V to 15V) allow for flexible design configurations and enable integration in various electronic systems.

No. of Terminals: 16

Having 16 terminals facilitates the connection of multiple inputs and outputs, enhancing functionality in circuit designs.

Package Style (Meter): IN-LINE

In-line package style is ideal for through-hole assembly, making it easier to install and replace in traditional PCB designs.

Propagation Delay (tpd): 800 ns

A propagation delay of 800 ns ensures moderate speed performance, suitable for various control and timing applications.

Maximum Operating Temperature: 85 °C

Can operate at temperatures up to 85 °C, making it reliable in higher temperature environments typically found in industrial settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is well-suited for use in harsh environments, ensuring durability and stability.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and reliability in connections, ensuring better durability over time.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in board layout, offering more design options in circuit configurations.

Maximum Seated Height: 5.1 mm

Compact seated height ensures compatibility with a wide range of board designs, particularly where space is at a premium.

Width: 7.62 mm

A width of 7.62 mm is optimal for tight layouts and allows integration into more compact electronic devices.

Minimum Supply Voltage (Vsup): 3 V

Minimum supply voltage as low as 3V permits operation in low-power designs, catering to energy-efficient applications.

Length: 20 mm

Length of 20 mm fits well in standard PCB designs, making it an easy choice for designers.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, ensuring reliability and performance in industrial applications.

Technology: CMOS

Using CMOS technology allows for low power consumption while maintaining performance, making it ideal for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole form factor ensures robust mechanical stability and is preferred in applications requiring higher durability.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm makes it easy to work with and compatible with numerous PCB designs for ease of integration.

Maximum Supply Voltage (Vsup): 15 V

Ability to operate up to 15V makes this product versatile for various high-voltage applications without risk of damage.

Technical Specifications

Digital Arithmetic Circuits HCF4008BE attributes and parameters. Explore more Digital Arithmetic Circuits devices from STMicroelectronics

Specs

Additional Features:

LG-MAX; FULL ADDER WITH INTERNAL CARRY LOOKAHEAD PERMITS RIPPLE CARRY CASCADING

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

20 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay (tpd):

800 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4008BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19