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F271-BAG-T

STMicroelectronics

F271-BAG-T by STMicroelectronics

F271-BAG-T by STMicroelectronics is a 16-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and operating temp range from -40 °C to 125 °C. It includes 144 terminals and supports ADC/PWM channels. Ideal for robust, low-profile designs with high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,735 parts In-Stock

1+ parts

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4,735

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Digiode

USA . 2,885 parts In-Stock

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2,885

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Anansix

USA . 1,016 parts In-Stock

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1,016

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 6 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

-

10k+ parts

$0.081

6

$0.085

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-

$0.081

Northwest PG Solutions

USA . 1,506 parts In-Stock

1+ parts

$0.093

100+ parts

-

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-

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$0.082

1,506

$0.093

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$0.082

IDEA Electronic Components Group

UK . 1,174 parts In-Stock

1+ parts

$40.940

100+ parts

-

1k+ parts

$36.846

10k+ parts

-

1,174

$40.940

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$36.846

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MKK Technologies

India . 668 parts In-Stock

1+ parts

$76.985

100+ parts

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668

$76.985

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DigiPath Technology Company

USA . 668 parts In-Stock

1+ parts

$76.985

100+ parts

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668

$76.985

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Corphita

USA . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

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$48.950

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2,114

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$48.950

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Overview

Unlock a world of innovation with the F271-BAG-T microcontroller from STMicroelectronics, a trusted leader in semiconductor technology. Designed for automotive applications, this high-performance solution combines reliability and versatility, making it ideal for demanding environments. With its low power consumption and robust features, elevate your projects while enjoying unparalleled support and quality assurance from a globally recognized manufacturer. Experience efficiency and performance like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material helps in reducing overall product weight while ensuring sufficient protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage enables the microcontroller to function effectively in a wide range of applications without risk of damage.

Address Bus Width: 23

A wider address bus allows for accessing more memory, increasing the microcontroller's capability to handle complex tasks.

Package Shape: SQUARE

The square shape optimizes space usage on the PCB, enhancing design flexibility and efficiency.

Bit Size: 16

A 16-bit architecture provides a good balance between performance and power efficiency, well-suited for various applications.

Power Supplies (V): 5

Operating at standard 5V simplifies design and integration with other electronic components.

No. of Terminals: 144

A higher number of terminals enables more peripheral devices and functionalities to be connected, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design is suitable for space-constrained applications while facilitating easy integration.

Minimum Supply Voltage: 4.5 V

This minimum voltage requirement allows for operation in a variety of environments and conditions.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes this microcontroller suitable for automotive and industrial applications.

CPU Family: ST10

The reliability and performance associated with the ST10 family improves overall system efficiency.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures reliable performance in extreme weather conditions.

Terminal Finish: MATTE TIN

Matte tin provides excellent solderability and corrosion resistance, enhancing the longevity of the connections.

ADC Channels: YES

The inclusion of ADC channels allows for efficient analog signal processing, making it ideal for sensor applications.

Terminal Position: QUAD

Quad terminal positioning supports easier routing on printed circuit boards, benefiting complex designs.

ROM Words: 131072

Substantial ROM capacity allows for storing extensive code, essential for complex programs.

Maximum Seated Height: 1.6 mm

A low seated height promotes efficient space usage on PCB, allowing for denser layout designs.

Width: 20 mm

The compact width contributes to a space-efficient design adaptable to various applications.

External Data Bus Width: 16

A 16-bit external data bus enhances data transfer rates, improving overall system performance.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency supports efficient processing speeds for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient reflow time ensures reliable solder joints during manufacturing, enhancing product reliability.

Peak Reflow Temperature °C: 260

This high temperature tolerance ensures compatibility with modern surface mount soldering processes.

Length: 20 mm

With a compact length, this microcontroller fits easily into a variety of electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it assures reliability and performance in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is suitable for controlling various electronic components and processes seamlessly.

RAM Bytes: 8192

Ample RAM allows for efficient data handling in applications that require complex computations.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing manufacturing efficiency.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies design and makes it compatible with a variety of power supplies.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, crucial for robotics and automation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, increasing product lifespan and flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for more connections in a smaller area, supporting compact designs.

Moisture Sensitivity Level (MSL): 3

A moderate MSL rating indicates reasonable handling requirements while maintaining reliability.

Speed: 40 rpm

This speed rating indicates suitability for various actuators and control systems in real-time applications.

No. of I/O Lines: 111

A high number of I/O lines allows for versatile connectivity options, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers F271-BAG-T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F271-BAG-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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