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F271-AEA-T

STMicroelectronics

F271-AEA-T by STMicroelectronics

F271-AEA-T by STMicroelectronics is a 16-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and operating temp range from -40 °C to 125 °C. It includes 111 I/O lines and supports ADC & PWM channels. Its compact flatpack design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,316 parts In-Stock

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2,316

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Vyrian

USA . 1,536 parts In-Stock

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1,536

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Digiode

USA . 1,411 parts In-Stock

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1,411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,017 parts In-Stock

1+ parts

$18.982

100+ parts

-

1k+ parts

$17.084

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2,017

$18.982

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$17.084

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Native Components

USA . 440 parts In-Stock

1+ parts

$23.998

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440

$23.998

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Northwest PG Solutions

USA . 1,676 parts In-Stock

1+ parts

$26.398

100+ parts

$23.758

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1,676

$26.398

$23.758

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MKK Technologies

India . 2,014 parts In-Stock

1+ parts

$35.695

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2,014

$35.695

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DigiPath Technology Company

USA . 2,014 parts In-Stock

1+ parts

$35.695

100+ parts

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2,014

$35.695

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Corphita

USA . 4,802 parts In-Stock

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4,802

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Parana Technologies

USA . 1,802 parts In-Stock

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$22.696

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1,802

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$22.696

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Overview

Unlock unparalleled performance with the F271-AEA-T microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, this robust device ensures reliability even in extreme temperatures, providing exceptional processing power and efficiency. With its versatile features, it empowers your projects to excel in smart systems, enhancing functionality while saving energy. Elevate your designs with the quality and trust that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, providing effective protection and heat dissipation for reliable operation in various environments.

Surface Mount: YES

Allows for compact design and improved performance due to reduced lead inductance, making it suitable for modern electronic applications.

Maximum Supply Voltage: 5.5 V

Flexible operating voltage range, enabling compatibility with various power supply systems.

Address Bus Width: 23

Enables addressing a larger memory space, enhancing the performance and functionalities of the microcontroller.

Package Shape: SQUARE

Optimal space-saving design, facilitating effective layout and integration in electronic circuits.

Bit Size: 16

Offers a good balance between performance and power consumption, making it suitable for a wide range of applications.

Power Supplies (V): 5

Standard voltage level simplifies integration and design, improving convenience for developers.

No. of Terminals: 144

Provides multiple connection options for peripherals, making it versatile for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained designs, enabling high-density PCB layouts without sacrificing performance.

Minimum Supply Voltage: 4.5 V

Allows for reliable operation across a range of supply voltages, enhancing the adaptability of the microcontroller.

Maximum Operating Temperature: 125 °C

Suitable for automotive applications where high temperature resilience is crucial for reliability.

CPU Family: ST10

A well-established family known for robust performance, making it a trusted choice for developers.

Minimum Operating Temperature: -40 °C

Ensures reliable performance in extreme cold conditions, ideal for use in automotive and industrial applications.

ADC Channels: YES

Enables analog-to-digital conversion, facilitating highly flexible and precise control in various applications.

Terminal Position: QUAD

Simplifies PCB layout and integration, allowing for efficient space management in device designs.

ROM Words: 131072

Generous ROM capacity supports extensive firmware and application storage, enhancing functionality.

Maximum Seated Height: 1.6 mm

Low profile height allows for space-saving designs while maintaining performance integrity.

Width: 20 mm

Compact width suitable for various applications without occupying excessive board space.

External Data Bus Width: 16

Facilitates efficient data transfer rates, improving overall system performance in data-intensive applications.

Maximum Clock Frequency: 8 MHz

Provides sufficient processing speed for a variety of applications, ensuring prompt execution of tasks.

Length: 20 mm

Compact length for space-efficient circuit designs, making it ideal for embedded systems.

Temperature Grade: AUTOMOTIVE

Designed to meet strict automotive standards, ensuring reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Highly integrated solution for managing various peripherals in a single package, reducing complexity.

RAM Bytes: 12288

Ample RAM allows for efficient data handling and multitasking capabilities within applications.

Technology: CMOS

Offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Facilitates easy soldering and reliable connections on PCBs, enhancing durability and performance.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies circuit design and offers versatility across different applications.

PWM Channels: YES

Supports pulse width modulation, enabling precise control in applications such as motor control and light dimming.

ROM Programmability: FLASH

Allows for easy updates and modifications to firmware, enhancing flexibility and longevity of the device.

Terminal Pitch: 0.5 mm

Fine pitch design suitable for modern high-density PCB layouts, ensuring efficient space utilization.

Speed: 40 rpm

Provides adequate performance for various applications, ensuring smooth operation in control systems.

No. of I/O Lines: 111

Generous number of I/O lines enables extensive interfacing capabilities, making it ideal for complex projects.

Technical Specifications

Microcontrollers F271-AEA-T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F271-AEA-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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