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F271-BAG5-T

STMicroelectronics

F271-BAG5-T by STMicroelectronics

F271-BAG5-T by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. It features 144 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,162 parts In-Stock

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3,162

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Digiode

USA . 2,037 parts In-Stock

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2,037

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Anansix

USA . 288 parts In-Stock

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288

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$28.225

100+ parts

-

1k+ parts

$25.402

10k+ parts

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1,760

$28.225

-

$25.402

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MKK Technologies

India . 501 parts In-Stock

1+ parts

$53.075

100+ parts

-

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501

$53.075

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DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$53.075

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501

$53.075

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Native Components

USA . 740 parts In-Stock

1+ parts

$86.630

100+ parts

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$83.165

740

$86.630

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-

$83.165

Northwest PG Solutions

USA . 2,058 parts In-Stock

1+ parts

$95.293

100+ parts

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2,058

$95.293

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Parana Technologies

USA . 1,903 parts In-Stock

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$33.747

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1,903

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$33.747

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Corphita

USA . 1,898 parts In-Stock

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1,898

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Overview

Unlock the power of innovation with the F271-BAG5-T microcontroller by STMicroelectronics. Renowned for their commitment to excellence, STMicroelectronics delivers unparalleled reliability and performance in this compact, low-profile package. Ideal for a wide range of applications—from industrial automation to consumer electronics—this microcontroller offers seamless energy efficiency, robust peripherals, and exceptional operating temperature resilience, empowering your designs to thrive in demanding environments. Elevate your projects with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material offers good protection against environmental factors.

Surface Mount: YES

Surface mount technology enables compact designs and efficient assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a widely used voltage range, ensuring compatibility with various power supplies.

Address Bus Width: 23

A wider address bus allows for more memory addressing capabilities, improving performance.

Package Shape: SQUARE

The square shape contributes to a balanced layout and easier board design.

Bit Size: 16

16-bit architecture enables efficient processing and operation for a variety of applications.

Power Supplies (V): 5

Standard 5V power requirement simplifies integration with existing electronic systems.

No. of Terminals: 144

A high number of terminals offers extensive connectivity options for peripherals and modules.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design facilitates space-saving PCB layouts, enhancing system design flexibility.

Minimum Supply Voltage: 4.5 V

Allows operation over a broader supply range, making it suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

Capable of withstanding higher temperatures ensures reliability in industrial environments.

CPU Family: ST10

The ST10 family provides a strong foundation for a wide range of applications with proven performance.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, making it suitable for harsh environments and outdoor use.

Terminal Finish: MATTE TIN

Provides excellent solderability and resistance to oxidation, ensuring long-term stability.

ADC Channels: YES

Built-in ADC channels enable direct interfacing with analog sensors, enhancing versatility.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and enhances electrical performance.

ROM Words: 131072

Generous ROM capacity allows for substantial program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

Low seated height is suitable for compact designs where space is a constraint.

Width: 20 mm

Standard width supports seamless integration into various PCB layouts.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer, improving overall performance.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency balances performance and power consumption effectively.

Maximum Time At Peak Reflow Temperature (s): 40

Defined reflow times ensure reliable solder connections during assembly processes.

Peak Reflow Temperature °C: 260

Durability during high-temperature processes ensures device integrity and reliability.

Length: 20 mm

Standard length allows easy compatibility with existing designs and circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading enhances reliability for extended use in challenging environments.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller type supports a wide range of applications in embedded systems.

RAM Bytes: 8192

Sufficient RAM capacity enables efficient processing of larger data sets, enhancing application performance.

Technology: CMOS

CMOS technology allows for low power consumption, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable electrical connections.

Nominal Supply Voltage: 5 V

Nominal voltage ensures reliability and standardization across various applications.

PWM Channels: YES

Supports PWM channels for motor control and other applications that require precise timing.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications without special equipment.

Terminal Pitch: 0.5 mm

Fine pitch enables dense PCB layouts, ideal for compact and efficient designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, useful for controlled storage environments.

Speed: 48 rpm

Moderate speed rating indicates suitability for various real-world applications, ensuring responsiveness.

No. of I/O Lines: 111

A high number of I/O lines enhances flexibility for interfacing with multiple peripherals and devices.

Technical Specifications

Microcontrollers F271-BAG5-T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F271-BAG5-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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