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F271-BAG-T-TR

STMicroelectronics

F271-BAG-T-TR by STMicroelectronics

F271-BAG-T-TR by STMicroelectronics is a 16-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and an operating temp range of -40 °C to 125 °C. It offers 144 terminals and supports ADC/PWM channels for versatile functionality. With a compact low-profile package, it ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,392 parts In-Stock

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1,392

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Anansix

USA . 798 parts In-Stock

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798

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Digiode

USA . 222 parts In-Stock

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222

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Distributors (Availability)

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Microchip USA

USA . 310 parts In-Stock

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$25.795

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310

$25.795

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Native Components

USA . 828 parts In-Stock

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$37.200

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$35.712

828

$37.200

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$35.712

Northwest PG Solutions

USA . 868 parts In-Stock

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$40.920

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868

$40.920

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IDEA Electronic Components Group

UK . 1,095 parts In-Stock

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$64.987

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$58.488

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1,095

$64.987

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$58.488

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Component Stockers USA

USA . 793 parts In-Stock

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$99.990

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$99.990

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MKK Technologies

India . 1,869 parts In-Stock

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$122.204

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$122.204

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DigiPath Technology Company

USA . 1,869 parts In-Stock

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$122.204

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1,869

$122.204

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Parana Technologies

USA . 1,751 parts In-Stock

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$77.702

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$77.702

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Corphita

USA . 370 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the F271-BAG-T-TR microcontroller from STMicroelectronics. Renowned for their cutting-edge innovations, STMicroelectronics delivers a powerhouse that excels in automotive and industrial applications. With robust features designed for extreme conditions and energy efficiency, this microcontroller not only ensures seamless operation but also enhances your product's longevity. Elevate your projects with unmatched quality and expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, enabling compact and high-density designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a wide range of standard power supply systems.

Address Bus Width: 23

A wider address bus width enables greater memory addressing capabilities, enhancing the microcontroller's performance in complex applications.

Package Shape: SQUARE

The square package shape facilitates easier layout planning on printed circuit boards, simplifying design processes.

Bit Size: 16

With a 16-bit size, this microcontroller is capable of handling more data at once compared to 8-bit counterparts, improving processing efficiency.

Power Supplies (V): 5

Works with a standard 5V power supply, making it easy to integrate into existing systems.

No. of Terminals: 144

A high number of terminals allows for numerous connections, making it versatile for various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for high-density mounting and is ideal for applications where space is limited.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage supports a wide operating range, enhancing reliability in varied scenarios.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes it suitable for automotive and industrial applications.

CPU Family: ST10

The ST10 CPU family provides robust performance and an array of features specifically designed for embedded applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is capable of functioning in extreme conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good solderability and long-term reliability in various environments.

ADC Channels: YES

Integrated ADC channels facilitate real-time data acquisition, enhancing the functionality of applications that require analog signal processing.

Terminal Position: QUAD

Quard terminal position allows for efficient routing on PCBs, promoting better performance and design flexibility.

ROM Words: 131072

The large ROM capacity enables the storage of substantial amounts of firmware, which is crucial for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height makes this microcontroller suitable for compact designs and applications with height constraints.

Width: 20 mm

The 20 mm width is ideal for a variety of layout configurations, providing flexibility in design.

External Data Bus Width: 16

A 16-bit external data bus width improves data transfer rates and overall operational speed.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency ensures satisfactory processing speed for various tasks, balancing performance and power consumption.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures compatibility with standard soldering processes, making assembly easier.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C supports reliable manufacturing processes, ensuring robust solder joints.

Length: 20 mm

A standard length of 20 mm complements its width for a balanced, compact design.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, it is engineered for reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripheral functions, streamlining system design.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can handle multiple tasks and data processing requirements efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and accessibility, enhancing production efficiency.

Nominal Supply Voltage: 5 V

Supports common 5V operations, making it easy to design and integrate with existing systems.

PWM Channels: YES

With PWM channels included, this microcontroller can efficiently control motors and other devices requiring variable power.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updates and modifications, enhancing the product's longevity and adaptability.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density applications, allowing for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the components can be handled and assembled with normal precautions, making it practical for production.

Speed: 40 rpm

This speed specification ensures the microcontroller can efficiently manage tasks in real-time applications.

No. of I/O Lines: 111

A high number of I/O lines offers extensive interfacing options, making it versatile for a range of applications.

Technical Specifications

Microcontrollers F271-BAG-T-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F271-BAG-T-TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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