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F271-AEA-P

STMicroelectronics

F271-AEA-P by STMicroelectronics

F271-AEA-P by STMicroelectronics is a 16-bit automotive microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 125 °C. It features 144 terminals, supports ADC and PWM channels, making it ideal for automotive applications. Its compact flatpack design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,620 parts In-Stock

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2,620

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Anansix

USA . 2,052 parts In-Stock

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2,052

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Digiode

USA . 203 parts In-Stock

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203

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$36.116

100+ parts

-

1k+ parts

$32.504

10k+ parts

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1,695

$36.116

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$32.504

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MKK Technologies

India . 172 parts In-Stock

1+ parts

$67.913

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172

$67.913

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DigiPath Technology Company

USA . 172 parts In-Stock

1+ parts

$67.913

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172

$67.913

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Northwest PG Solutions

USA . 2,039 parts In-Stock

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2,039

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Parana Technologies

USA . 717 parts In-Stock

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$43.182

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717

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$43.182

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Native Components

USA . 680 parts In-Stock

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680

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Corphita

USA . 646 parts In-Stock

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646

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Overview

Unlock the potential of your projects with the F271-AEA-P microcontroller from STMicroelectronics, a leader in innovation and quality. With its robust automotive-grade design, this versatile device ensures reliability in demanding environments. Benefit from its high performance, extensive I/O capabilities, and energy efficiency, making it ideal for everything from advanced automotive systems to smart home applications. Experience seamless integration and exceptional support, empowering your next big idea!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with standard digital systems.

Address Bus Width: 23

A 23-bit address bus width allows for a larger memory space, making it effective for complex applications.

Package Shape: SQUARE

The square package shape provides uniform dimensions that facilitate better heat dissipation.

Bit Size: 16

This 16-bit architecture balances performance and efficiency, ideal for processing tasks requiring moderate complexity.

Power Supplies (V): 5

Operating on a standard power supply of 5 V simplifies power management in embedded systems.

No. of Terminals: 144

With 144 terminals, this microcontroller supports a wide range of peripheral devices and functionalities.

Package Style (Meter): FLATPACK

Flatpack packaging is advantageous for space-saving applications in compact electronic designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows the product to function effectively under varying power conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller is suitable for automotive and high-temperature environments.

CPU Family: ST10

The ST10 family provides excellent performance, optimized for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this product ideal for usage in extreme environmental conditions.

ADC Channels: YES

Equipped with ADC channels, it can easily interface with sensors, increasing its versatility in various applications.

Terminal Position: QUAD

Quad terminal positioning improves soldering quality and ensures reliable electrical connections.

ROM Words: 131072

A significant amount of ROM allows more complex programs to be stored, enhancing functionality.

Maximum Seated Height: 4.07 mm

A low profile height ensures compatibility with compact design layouts in modern electronics.

Width: 28 mm

A 28 mm width strikes a good balance between functionality and board space efficiency.

External Data Bus Width: 16

A 16-bit external data bus width facilitates rapid data transfers with other components.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency ensures efficient processing speed for most control tasks.

Length: 28 mm

A matching length of 28 mm allows for easier placements on PCBs and overall design coherence.

Temperature Grade: AUTOMOTIVE

This temperature grade confirms the microcontroller's reliability in automotive applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates both control and processing capabilities, minimizing system complexity.

RAM Bytes: 12288

With 12 KB of RAM, it supports fairly complex computations and temporary data storage.

Technology: CMOS

CMOS technology provides high efficiency and low power consumption, extending battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals ensure easier assembly and better performance in soldering operations.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with typical digital logic levels, making interfacing straightforward.

PWM Channels: YES

The presence of PWM channels enables precise control over motors and other analog devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch facilitates higher density designs, accommodating more connections in limited space.

Speed: 64 rpm

At 64 rpm, this product offers effective performance for various motor control applications.

No. of I/O Lines: 111

111 I/O lines provide extensive connectivity options, allowing for complex interfacing with various peripherals.

Technical Specifications

Microcontrollers F271-AEA-P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

F271-AEA-P Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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