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F271-AEA-P-TR

STMicroelectronics

F271-AEA-P-TR by STMicroelectronics

F271-AEA-P-TR by STMicroelectronics is a 16-bit automotive microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 125 °C. It features 144 terminals, supports ADC and PWM channels, making it ideal for automotive applications. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,769 parts In-Stock

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3,769

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Anansix

USA . 2,245 parts In-Stock

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2,245

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Vyrian

USA . 1,985 parts In-Stock

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1,985

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ComSIT Distribution GmbH

Germany . 390 parts In-Stock

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390

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Distributors (Availability)

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Native Components

USA . 71 parts In-Stock

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$7.990

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71

$7.990

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Northwest PG Solutions

USA . 929 parts In-Stock

1+ parts

$8.789

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$7.910

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929

$8.789

$7.910

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IDEA Electronic Components Group

UK . 189 parts In-Stock

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$15.885

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$14.296

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189

$15.885

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$14.296

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MKK Technologies

India . 1,996 parts In-Stock

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$29.870

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1,996

$29.870

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DigiPath Technology Company

USA . 1,996 parts In-Stock

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$29.870

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1,996

$29.870

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Corphita

USA . 700 parts In-Stock

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700

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Parana Technologies

USA . 51 parts In-Stock

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$18.993

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51

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$18.993

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Overview

Unlock the power of innovation with the F271-AEA-P-TR microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for automotive applications, this robust solution ensures reliability even in extreme conditions, enhancing performance and efficiency. With its superior features and exceptional quality, the F271-AEA-P-TR empowers your projects, providing seamless integration and unparalleled support, making it the perfect choice for developers aiming to create tomorrow's solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliable performance in various environments.

Surface Mount: YES

Allows for compact PCB designs and automated assembly, ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options while ensuring the microcontroller operates within safe voltage limits.

Address Bus Width: 23

Enables efficient memory addressing, supporting larger memory configurations for complex applications.

Package Shape: SQUARE

Standard shape simplifies integration into various design layouts and reduces assembly complexity.

Bit Size: 16

Offers a good balance between processing power and memory efficiency, suitable for a wide range of applications.

Power Supplies (V): 5

Supports standard logic levels, making it compatible with a wide array of peripherals and components.

No. of Terminals: 144

Provides ample connectivity options for interfacing with various sensors and components.

Package Style (Meter): FLATPACK

Enables a low-profile design, essential for modern compact electronic devices.

Minimum Supply Voltage: 4.5 V

Allows operation at lower voltage levels, enhancing flexibility in power management.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, making it ideal for automotive and industrial applications.

CPU Family: ST10

Access to a rich ecosystem of tools and libraries, which accelerates development time and reduces costs.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme conditions, critical for automotive and outdoor applications.

ADC Channels: YES

Integrated Analog-to-Digital Converters facilitate easy interfacing with analog sensors.

Terminal Position: QUAD

Enhances layout flexibility, allowing for better space management on PCBs.

ROM Words: 131072

Large instruction memory enables complex functionalities and more extensive program storage.

Maximum Seated Height: 4.07 mm

Low profile contributes to compact designs that can fit into smaller spaces.

Width: 28 mm

Compact dimensions support efficient PCB layouts, essential in modern electronics.

External Data Bus Width: 16

Facilitates faster data transfer rates, crucial for performance-intensive applications.

Maximum Clock Frequency: 8 MHz

Provides a balance of speed and power consumption, suitable for a variety of applications.

Length: 28 mm

Compact size complements the width for symmetrical designs emphasizing compactness.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent requirements of automotive environments, ensuring reliability.

Peripheral IC Type: MICROCONTROLLER

Versatile component that can handle various tasks in embedded systems, simplifying design complexity.

RAM Bytes: 12288

Adequate RAM allows for smooth operation and efficient execution of tasks in complex applications.

Technology: CMOS

Ensures low static and dynamic power consumption, enhancing overall system efficiency.

Terminal Form: GULL WING

Facilitates easy soldering on PCBs, promoting efficient manufacturing processes.

Nominal Supply Voltage: 5 V

Standard voltage levels allow for compatibility with common power supplies and peripherals.

PWM Channels: YES

Integrated Pulse Width Modulation channels enable precise control in applications like motor control or dimming.

ROM Programmability: FLASH

Flash memory enables reprogramming, increasing flexibility in development and deployment.

Terminal Pitch: 0.65 mm

Fine pitch allows for denser layouts, improving the overall integration of components in limited spaces.

Speed: 64 rpm

Sufficient speed for moderate applications while ensuring energy efficiency.

No. of I/O Lines: 111

Provides extensive interfacing capabilities, making it suitable for complex systems requiring many connections.

Technical Specifications

Microcontrollers F271-AEA-P-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

F271-AEA-P-TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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