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F271-AEA-T-TR

STMicroelectronics

F271-AEA-T-TR by STMicroelectronics

F271-AEA-T-TR by STMicroelectronics is a 16-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and an operating temp range of -40 °C to 125 °C. It offers 144 terminals, with 111 I/O lines and supports PWM & ADC channels. This low-profile package ensures efficient performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,203 parts In-Stock

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Vyrian

USA . 1,244 parts In-Stock

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Anansix

USA . 986 parts In-Stock

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Native Components

USA . 867 parts In-Stock

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$0.069

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$0.066

867

$0.069

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$0.066

Northwest PG Solutions

USA . 1,888 parts In-Stock

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$0.076

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$0.067

1,888

$0.076

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$0.067

IDEA Electronic Components Group

UK . 795 parts In-Stock

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$47.505

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$42.755

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795

$47.505

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MKK Technologies

India . 197 parts In-Stock

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$89.330

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$89.330

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DigiPath Technology Company

USA . 197 parts In-Stock

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$89.330

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Corphita

USA . 4,061 parts In-Stock

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Parana Technologies

USA . 1,722 parts In-Stock

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$56.800

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Overview

Unlock unprecedented performance with the F271-AEA-T-TR microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Designed for automotive applications, this robust and reliable component ensures optimal efficiency and superior thermal management in demanding environments. With its low-profile design and advanced features, it empowers your projects while delivering exceptional value. Experience innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental stress, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space utilization on circuit boards.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage is well within a common range, ensuring compatibility with many existing power sources.

Address Bus Width: 23

A wider address bus enables access to more memory, enhancing functionality in memory-intensive applications.

Package Shape: SQUARE

The square package shape allows for equal thermal and electrical performance in all directions.

Bit Size: 16

A 16-bit architecture provides a good balance of performance and processing power for a wide range of tasks.

Power Supplies (V): 5

The standard 5V power supply requirement makes integration straightforward with standard power systems.

No. of Terminals: 144

With 144 terminals, this microcontroller can support extensive connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is ideal for space-constrained applications, maintaining performance without increasing size.

Minimum Supply Voltage: 4.5 V

Flexibility in supply voltage ensures reliable operation in varying power environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature indicates suitability for harsh environments and automotive applications.

CPU Family: ST10

The ST10 family is known for robust performance, making it a reliable choice for various applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures ensures reliability under severe environmental conditions.

ADC Channels: YES

On-chip ADC channels facilitate easy interfacing with analog sensors, boosting versatility.

Terminal Position: QUAD

Quad terminal positioning enhances soldering and electrical performance compared to other configurations.

ROM Words: 131072

Large ROM capacity allows for significant program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low seated height aids in minimizing device profiles, which is beneficial for compact designs.

Width: 20 mm

A standard width facilitates easier integration into existing products and designs.

External Data Bus Width: 16

A 16-bit external data bus supports wider data transfer, enhancing communication speeds.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency provides adequate processing speed for a variety of applications.

Length: 20 mm

Length of 20 mm allows for versatile mounting options without compromising PCB space.

Temperature Grade: AUTOMOTIVE

Automotive temperature grading ensures reliable performance in automotive and demanding applications.

Peripheral IC Type: MICROCONTROLLER

Optimized for control tasks, this microcontroller excels in a variety of embedded systems.

RAM Bytes: 12288

Ample RAM memory allows for smoother execution of programs and handling of data.

Technology: CMOS

CMOS technology enhances power efficiency while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capabilities, improving reliability and durability.

Nominal Supply Voltage: 5 V

A nominal voltage of 5V simplifies power supply design and ensures broad compatibility.

PWM Channels: YES

PWM capabilities enhance control over motors and other actuators, making this microcontroller versatile.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, key for product longevity.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables more connections in a smaller footprint, ideal for compact applications.

Speed: 40 rpm

Performance at 40 rpm is suitable for many typical applications, particularly in motor control.

No. of I/O Lines: 111

A generous number of I/O lines provides flexibility in interfacing with various external devices.

Technical Specifications

Microcontrollers F271-AEA-T-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F271-AEA-T-TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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