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F271-BAG-P

STMicroelectronics

F271-BAG-P by STMicroelectronics

F271-BAG-P by STMicroelectronics is a 16-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and an operating temp range of -40 °C to 125 °C. It includes 144 terminals and supports ADC and PWM channels. With a clock frequency of up to 8 MHz, it ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,482 parts In-Stock

1+ parts

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4,482

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Digiode

USA . 2,985 parts In-Stock

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2,985

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Anansix

USA . 2,624 parts In-Stock

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2,624

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$18.703

100+ parts

-

1k+ parts

$16.832

10k+ parts

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333

$18.703

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$16.832

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MKK Technologies

India . 1,136 parts In-Stock

1+ parts

$35.169

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1,136

$35.169

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DigiPath Technology Company

USA . 1,136 parts In-Stock

1+ parts

$35.169

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1,136

$35.169

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Corphita

USA . 2,954 parts In-Stock

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2,954

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Parana Technologies

USA . 2,270 parts In-Stock

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$22.362

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2,270

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$22.362

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Northwest PG Solutions

USA . 701 parts In-Stock

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$3.949

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701

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$3.949

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Native Components

USA . 473 parts In-Stock

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$3.909

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473

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$3.909

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Overview

Unlock your project’s potential with the F271-BAG-P microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile device is designed for automotive applications, ensuring reliability even in extreme temperatures. With a robust architecture that supports various peripherals, it streamlines development while delivering exceptional performance. Experience peace of mind and elevate your designs with proven technology from a trusted manufacturer, enhancing efficiency and driving success in your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various environments.

Surface Mount: YES

Allows for a compact design and is suitable for modern PCB assembly processes.

Maximum Supply Voltage: 5.5 V

Provides a high margin for voltage variations, ensuring stable operation.

Address Bus Width: 23

Enables access to a large memory space, improving the performance of data-intensive applications.

Package Shape: SQUARE

Optimizes space on circuit boards, facilitating easy integration into various designs.

Bit Size: 16

Offers a good balance between processing capability and resource utilization for embedded applications.

Power Supplies (V): 5

Common voltage level, promoting compatibility with many existing systems.

No. of Terminals: 144

Provides ample connectivity options for interfacing with various peripherals and components.

Package Style (Meter): FLATPACK

Enables easier handling and placement on PCBs, reducing the risk of soldering issues.

Minimum Supply Voltage: 4.5 V

Allows for operation in varied environments with slight voltage fluctuations.

Maximum Operating Temperature: 125 °C

Suitable for automotive applications, where components are often exposed to extreme temperatures.

CPU Family: ST10

Part of a respected family known for its performance and functionality.

Minimum Operating Temperature: -40 °C

Ideal for harsh environments, making it suitable for automotive and industrial applications.

ADC Channels: YES

Built-in ADC allows for easier integration of sensors and data conversion in applications.

Terminal Position: QUAD

Facilitates efficient use of PCB space and enhances signal integrity.

ROM Words: 131072

Large on-chip memory capacity enhances the functionality of complex applications.

Maximum Seated Height: 4.07 mm

Compact design ideal for space-constrained applications.

Width: 28 mm

Compact package dimensions facilitate integration into restricted designs.

External Data Bus Width: 16

Wider bus allows for faster data transfers, increasing overall system performance.

Maximum Clock Frequency: 8 MHz

Supports efficient processing speeds for a range of applications.

Length: 28 mm

Maintains a low profile, perfect for compact and embedded designs.

Temperature Grade: AUTOMOTIVE

Built to withstand conditions faced in automotive environments, ensuring longevity and reliability.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for embedded applications, providing tailored functionality.

RAM Bytes: 8192

Provides sufficient memory for handling data, making it suitable for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Facilitates easier soldering and assembly in surface mount applications.

Nominal Supply Voltage: 5 V

Simplifies design considerations thanks to compatibility with common power supplies.

PWM Channels: YES

Built-in PWM capabilities allow for motor control and other applications requiring variable power.

Terminal Pitch: 0.65 mm

Dense pin configuration, maximizing I/O capabilities in a compact footprint.

Speed: 64 rpm

Suitable for low-speed applications, adding versatility in various use cases.

No. of I/O Lines: 111

Offers extensive connectivity options, facilitating complex implementations and integrations.

Technical Specifications

Microcontrollers F271-BAG-P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

F271-BAG-P Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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