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E-TDA7590TR

STMicroelectronics

E-TDA7590TR by STMicroelectronics

E-TDA7590TR by STMicroelectronics is a versatile DSP with a 24-bit architecture, operating at up to 16 MHz. It supports supply voltages from 1.62V to 1.98V and features a robust temperature range of -40 °C to 85°C. Ideal for industrial applications, it offers high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,427 parts In-Stock

1+ parts

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3,427

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Digiode

USA . 3,240 parts In-Stock

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3,240

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Pegasus Components GmbH

Germany . 3,200 parts In-Stock

1+ parts

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3,200

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ComSIT Distribution GmbH

Germany . 3,020 parts In-Stock

1+ parts

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3,020

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Anansix

USA . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 76 parts In-Stock

1+ parts

$7.131

100+ parts

-

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-

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76

$7.131

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$15.170

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-

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281

$15.170

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IDEA Electronic Components Group

UK . 1,474 parts In-Stock

1+ parts

$50.398

100+ parts

-

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$45.358

10k+ parts

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1,474

$50.398

-

$45.358

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Corohmni

South Africa . 5,081 parts In-Stock

1+ parts

$73.945

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5,081

$73.945

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MKK Technologies

India . 1,089 parts In-Stock

1+ parts

$94.769

100+ parts

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1,089

$94.769

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

$94.769

100+ parts

-

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1,089

$94.769

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QUARKTWIN TECHNOLOGY LTD

USA . 18,521 parts In-Stock

1+ parts

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18,521

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Corphita

USA . 4,994 parts In-Stock

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4,994

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Microchip USA

USA . 3,748 parts In-Stock

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3,748

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 1,474 parts In-Stock

1+ parts

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100+ parts

$60.258

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1,474

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$60.258

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Northwest PG Solutions

USA . 824 parts In-Stock

1+ parts

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100+ parts

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$6.989

10k+ parts

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824

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$6.989

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Overview

Unlock unparalleled performance with the E-TDA7590TR from STMicroelectronics, a leader in innovative technology. This high-quality Digital Signal Processor is crafted for reliability and efficiency, powering applications across audio processing, industrial control, and beyond. With its compact design and robust capabilities, it ensures seamless integration into your projects, delivering exceptional value and unmatched advantages to elevate your solutions. Experience excellence with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Enables efficient space-saving designs and allows for automated assembly in modern applications.

Maximum Supply Voltage: 1.98 V

Low maximum supply voltage helps to reduce power consumption, making it suitable for battery-operated devices.

Address Bus Width: 19

A wider address bus enables access to a larger memory space for complex processing tasks.

Package Shape: SQUARE

Square-shaped packages are easier to handle and mount on PCBs, improving manufacturing efficiency.

Bit Size: 24

The 24-bit architecture offers high-resolution processing capabilities, ideal for signal processing applications.

Power Supplies (V): 1.8, 3.3

Versatile power supply options cater to a range of applications, enhancing design flexibility.

No. of Terminals: 144

A higher number of terminals supports more connectivity options and functionality for complex designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This style allows for excellent thermal management and dense packing, fitting modern electronic designs.

Minimum Supply Voltage: 1.62 V

This feature allows the DSP to operate effectively under lower voltage conditions, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

This temperature range ensures reliable performance in industrial and outdoor environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures makes this DSP suitable for harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning enhances the stability and connectivity of the component on the PCB.

Maximum Seated Height: 1.2 mm

A low seated height supports compact design requirements, enabling smaller electronic devices.

RAM Words: 131072

This substantial RAM capacity allows for processing of complex algorithms and data-intensive applications.

Width: 20 mm

A compact width contributes to layout flexibility in printed circuit boards, facilitating design integration.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging, improving development efficiency.

External Data Bus Width: 24

The 24-bit external data bus accommodates high-speed data transfer, enhancing overall performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz supports efficient data processing speeds for real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel data processing, boosting performance in demanding tasks.

Length: 20 mm

The uniform length offers design consistency and ease of integration into various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation for critical applications in tough environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designated as a DSP, this product is optimal for applications requiring advanced signal processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high-speed processing, making it a preferred choice in the industry.

Terminal Form: GULL WING

Gull wing terminals facilitate easier manual soldering and automated assembly processes.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA ensures efficient energy use while providing sufficient power for processing needs.

Nominal Supply Voltage: 1.8 V

Operating at a nominal 1.8 V enhances the efficiency of low-power designs, critical for portable applications.

Terminal Pitch: 0.5 mm

Fine pitch allows for denser component placement on PCBs, essential for compact electronic devices.

Format: FIXED POINT

Fixed-point format is advantageous for applications requiring predictable performance without IEEE floating-point overhead.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates controlled moisture sensitivity, suitable for reflow soldering processes.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient data manipulation, enhancing processing capabilities in DSP applications.

Technical Specifications

Digital Signal Processors (DSPs) E-TDA7590TR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

24

Boundary Scan:

YES

Maximum Clock Frequency:

16 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

E-TDA7590TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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