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E-TDA7590

STMicroelectronics

E-TDA7590 by STMicroelectronics

E-TDA7590 by STMicroelectronics is a 24-bit DSP with a max supply voltage of 1.98V and operates at temperatures from -40 °C to 85°C. It features a 19-bit address bus and supports multiple internal architectures. Ideal for industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,413 parts In-Stock

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5,413

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Digiode

USA . 2,050 parts In-Stock

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2,050

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Anansix

USA . 1,199 parts In-Stock

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1,199

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Distributors (Availability)

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AZTECH Wire

Italy . 1,040 parts In-Stock

1+ parts

$14.060

100+ parts

-

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1,040

$14.060

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IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$49.338

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-

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$44.404

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2,044

$49.338

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$44.404

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Corohmni

South Africa . 648 parts In-Stock

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$71.527

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648

$71.527

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MKK Technologies

India . 1,751 parts In-Stock

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$92.776

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1,751

$92.776

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DigiPath Technology Company

USA . 1,751 parts In-Stock

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$92.776

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1,751

$92.776

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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673

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,051 parts In-Stock

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Microchip USA

USA . 3,557 parts In-Stock

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3,557

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Northwest PG Solutions

USA . 1,336 parts In-Stock

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1,336

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 688 parts In-Stock

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Native Components

USA . 66 parts In-Stock

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Parana Technologies

USA . 1 parts In-Stock

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$58.991

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1

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$58.991

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Overview

Unlock the potential of your projects with the E-TDA7590 from STMicroelectronics, a leader in high-quality digital signal processing solutions. Designed for versatile applications, this DSP delivers exceptional performance and reliability, even in challenging environments. With a compact design and efficient power consumption, it ensures seamless integration into your systems, enhancing audio and signal processing capabilities while providing unmatched value for your innovation-driven goals. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package ensures protection against environmental factors, making the DSP robust for various applications.

Surface Mount: YES

Surface mount technology allows for compact device integration, ideal for space-constrained designs.

Maximum Supply Voltage: 1.98 V

Low maximum supply voltage contributes to reduced power consumption, enhancing energy efficiency.

Address Bus Width: 19

A wider address bus allows for addressing more memory locations, improving data processing capabilities.

Package Shape: SQUARE

The square package shape allows for uniform placement and heat distribution, which is beneficial for performance.

Bit Size: 24

24-bit data processing offers higher precision and accuracy, making it suitable for complex signal processing tasks.

Power Supplies (V): 1.8, 3.3

Dual voltage supply options provide flexibility for integration into different system architectures.

No. of Terminals: 144

A higher number of terminals facilitates better connectivity and integration with other components in the system.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style enables efficient thermal management, ensuring reliable performance under high workloads.

Minimum Supply Voltage: 1.62 V

The minimum supply voltage allows for operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum temperature tolerance makes this DSP suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in cold conditions, widening application range.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability, improving assembly reliability and production yield.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing on PCB, making layout design straightforward.

Maximum Seated Height: 1.2 mm

The low seating height contributes to a slimmer design, which is preferable for space-constrained applications.

RAM Words: 131072

Sufficient RAM capacity supports complex and demanding applications, enhancing processing performance.

Width: 20 mm

Standard width can fit into various PCB layouts, ensuring compatibility with different designs.

Boundary Scan: YES

Boundary scan capabilities facilitate easier testing, debugging, and verification of PCB assemblies.

External Data Bus Width: 24

A 24-bit external data bus supports high-speed data transfer, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

A decent clock frequency allows for efficient processing of signals, suitable for real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data handling and processing efficiency, ideal for complex operations.

Length: 20 mm

Standard length aids in uniformity across designs, ensuring compatibility with existing systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in demanding environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a DSP, this IC is specifically designed for efficient signal processing, ideal for audio, video, or communication applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing performance in electronic circuits.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and handle, ensuring reliable connections and ease of assembly.

Maximum Supply Current: 150 mA

The moderate supply current requirement allows for integration into low-power systems without excessive energy draw.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V supports energy-efficient operation, making it ideal for portable applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact design while ensuring adequate spacing for soldering.

Format: FIXED POINT

Fixed-point processing is advantageous for many control applications, simplifying computations in digital signal processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, guiding storage and handling practices to ensure reliability.

Barrel Shifter: YES

The presence of a barrel shifter enhances the DSP's capability for efficient arithmetic and data manipulation.

Technical Specifications

Digital Signal Processors (DSPs) E-TDA7590 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

24

Boundary Scan:

YES

Maximum Clock Frequency:

16 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

E-TDA7590 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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